Data Sheet
Table Of Contents
- Table of Contents
- 1. Features List
- 2. Ordering Information
- 3. System Overview
- 4. Electrical Specifications
- 5. Typical Applications and Connections
- 6. Pin Descriptions
- 7. Package Outline
- 8. Land Pattern
- 9. Top Marking
- 10. Tape and Reel Specifications
- 11. Software Reference
- 12. Certifications
- 13. Revision History
Dimension mm
E1 5.70
E2 5.10
E3 2.92
E4 2.85
E5 1.65
E6 4.50
E7 2.40
E8 1.20
E9 4.50
L 0.48
L1 0.67
eE1 0.60
eE2 0.60
Notes:
1. General
a. All feature sizes shown are at
Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05mm is assumed.
b. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
2. Stencil Design
a. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste re-
lease.
b. The stencil thickness should be 0.100mm (4 mils).
c. The stencil aperture to land pad size recommendation is 80% paste coverage.
The above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different
parameters and fine tune their SMT process as required for their application and tooling.
WFM200S Data Sheet
Land Pattern
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