User's Guide
Table Of Contents
- 1. WFM200 Pinout
- 2. Device Configuration
- 3. Features Description
- 4. Power Supplies
- 5. Application Schematic Recommendations
- 6. Typical Application Schematics
- 7. Layout Recommendations
- 7.1 Generic RF Layout Considerations
- 7.2 GND and RF Pads Including the Diversity Port and External Antennas
- 7.3 Module Antenna
- 7.3.1 Small Board Size Recommendations for Good RF Performance
- 7.3.2 Extended X Dimension Recommendation for Good RF Performance
- 7.3.3 Y Dimension (65 to 80 mm) Recommendation for Good RF Performance
- 7.3.4 Y Dimension (80 mm or Larger) Recommendation for Good RF Performance
- 7.3.5 WFM200 Portion One Corner Bias with 3 mm Metal Keep-Outs
- 7.3.6 Recommended Antenna Loop Trace Capacitor Values
- 7.4 WFM200 Reference Evaluation Board
- 8. Recommendations for Certification
- 9. Package Outline
- 10. Integral Antenna Loop and Keep-Out Required Dimensions
- 11. Recommended PCB Land Pattern
Dim mm
E5 1.65
E6 4.50
E7 2.40
E8 1.20
E9 4.50
L 0.48
L1 0.67
eE1 0.60
eE2 0.60
Note:
1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed.
2. Dimensioning and Tolerance is per the ANSI Y14.5M-1994 specification.
Table 11.2. Stencil Design
Pad No. Pad Size (mm) Pad Coordinates (X, Y)
47 0.32 x 0.48 Pad Center Origin (0,0)
1 0.32 x 0.48 (0.00, -1.60)
2 0.32 x 0.48 (0.00, -2.10)
9 0.32 x 0.48 (0.00, -5.60)
10 0.32 x 0.48 (0.60, -5.75)
19 0.32 x 0.48 (5.10, -5.75)
20 0.32 x 0.48 (5.70, -5.60)
31 0.32 x 0.48 (5.70, -0.10)
32 0.32 x 0.48 (5.10, -0.05)
36 0.32 x 0.48 (5.10, -1.65)
45 0.32 x 0.48 (0.60, -1.65)
49 0.32 x 0.48 (0.00, -1.00)
46 0.32 x 0.48 (2.92, 0.00)
50 0.67 x 0.67 (4.05, -2.63)
51 0.67 x 0.67 (2.85, -2.63)
52 0.67 x 0.67 (1.65, -2.63)
55 0.67 x 0.67 (1.65, -3.70)
58 0.67 x 0.67 (1.65, -4.77)
Note:
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
2. The stencil thickness should be 0.100 mm (4 mils).
3. The stencil aperture to land pad size recommendation is 70% paste coverage.
UG395: WFM200 Hardware Design User's Guide
Recommended PCB Land Pattern
silabs.com | Building a more connected world. Preliminary Rev. 0.1 | 36