User's Guide

Dim mm
E5 1.65
E6 4.50
E7 2.40
E8 1.20
E9 4.50
L 0.48
L1 0.67
eE1 0.60
eE2 0.60
Note:
1. All feature sizes shown are at Maximum Material Condition (MMC) and a card fabrication tolerance of 0.05 mm is assumed.
2. Dimensioning and Tolerance is per the ANSI Y14.5M-1994 specification.
Table 11.2. Stencil Design
Pad No. Pad Size (mm) Pad Coordinates (X, Y)
47 0.32 x 0.48 Pad Center Origin (0,0)
1 0.32 x 0.48 (0.00, -1.60)
2 0.32 x 0.48 (0.00, -2.10)
9 0.32 x 0.48 (0.00, -5.60)
10 0.32 x 0.48 (0.60, -5.75)
19 0.32 x 0.48 (5.10, -5.75)
20 0.32 x 0.48 (5.70, -5.60)
31 0.32 x 0.48 (5.70, -0.10)
32 0.32 x 0.48 (5.10, -0.05)
36 0.32 x 0.48 (5.10, -1.65)
45 0.32 x 0.48 (0.60, -1.65)
49 0.32 x 0.48 (0.00, -1.00)
46 0.32 x 0.48 (2.92, 0.00)
50 0.67 x 0.67 (4.05, -2.63)
51 0.67 x 0.67 (2.85, -2.63)
52 0.67 x 0.67 (1.65, -2.63)
55 0.67 x 0.67 (1.65, -3.70)
58 0.67 x 0.67 (1.65, -4.77)
Note:
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
2. The stencil thickness should be 0.100 mm (4 mils).
3. The stencil aperture to land pad size recommendation is 70% paste coverage.
UG395: WFM200 Hardware Design User's Guide
Recommended PCB Land Pattern
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