Data Sheet
Table Of Contents
- wgm160p-datasheet-20190225 v2
- ug384-wgm160p-hardware-design-users-guide-20190225
9. Soldering Recommendations
The WGM160P is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent on the
thermal mass of the entire populated PCB, heat transfer efficiency of the oven, and particular type of solder paste used.
• Refer to technical documentations of particular solder paste for profile configurations.
• Avoid using more than two reflow cycles.
• Aperture size of the stencil should be 1:1 with the pad size.
• A no-clean, type-3 solder paste is recommended.
• For further recommendation, please refer to the JEDEC/IPC J-STD-020, IPC-SM-782 and IPC 7351 guidelines.
• Above notes and stencil design are shared as recommendations only. A customer or user may find it necessary to use different
parameters and fine tune their SMT process as required for their application and tooling.
WGM160P Wi-Fi
®
Module Data Sheet
Soldering Recommendations
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