Specifications

SIM6600-M2 Hardware Design V1.00
www.simcom.com
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LTE-FDD B39(10M) TBD TBD
LTE-FDD B40(10M) TBD TBD
LTE-FDD B41(10M) TBD TBD
The data in above table are gotten at static condition.
Per 3GPP specification.
5.7 ESD
Module is sensitive to ESD in the process of storage, transporting, and assembling. When Module is
mounted on the users’ mother board, the ESD components should be placed beside the connectors which
human body may touch, such as USIM card holder, SD card holder, audio jacks, switches, USB interface,
etc. The following table shows the Module ESD measurement performance without any external ESD
component.
Table 35: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)
Part Contact discharge Air discharge
VBAT, GND
TBD TBD
Antenna port
TBD TBD
FUL_CARD_POWER_OFF#
TBD TBD
USB
TBD TBD
RESET_N
TBD TBD
UIM Card
TBD TBD
Other PADs
TBD TBD
NOTE