User's Manual
Table Of Contents
- RF Exposure Statement:
- General Notes
- Copyright
- Contents
- Table Index
- Figure Index
- Revision History
- 1Introduction
- 2Package Information
- 3Interface Application
- 3.1Power Supply
- Figure 5: VBAT voltage drop during burst emission
- 3.1.1Power Supply Design Guide
- Figure 6: Power supply application circuit
- Table 7: Recommended Zener diode list
- 3.1.2Recommended Power Supply Circuit
- Figure 7: Linear regulator reference circuit
- Figure 8: Switching mode power supply reference ci
- 3.1.3Voltage Monitor
- 3.2Power on/Power off/Reset Function
- 3.3UART Interface
- 3.4USB Interface
- 3.5USIM Interface
- 3.6PCM Interface
- 3.7SD Interface
- 3.8I2C Interface
- 3.9SDIO Interface
- 3.10SPI Interface
- 3.11Network status
- 3.12Flight Mode Control
- Switch
- 3.1Power Supply
- 4RF Specifications
- 5Electrical Specifications
- 6SMT Production Guide
- 7Packaging
- Appendix
SIM7600SA-H_User Manual_V1.00
2017-10-11
Smart Machine Smart Decision
6 SMT Production Guide
6.1 Typical SMT Reflow Profile
SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only
a generic recommendation and should be adjusted to the specific application and manufacturing
constraints.
Figure 34: The ramp-soak-spike reflow profile of SIM7600SA-H
Note: For more details about secondary SMT, please refer to the document [21].
6.2 Moisture Sensitivity Level (MSL)
SIM7600SA-H is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC
J-STD-033. If the prescribed time limit is exceeded, users should bake modules for 192 hours in
drying equipment (<5% RH) at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not
heat-resistant, and only can be baked at 45° C.
Table 36: Moisture Sensitivity Level and Floor Life
Moisture Sensitivity Level
(MSL)
Floor Life (out of bag) at factory ambient≤30°C/60% RH or as
stated
1
Unlimited at ≦30℃/85% RH
2
1 year
2a
4 weeks
3
168 hours