User's Manual
Table Of Contents
- RF Exposure Statement:
- General Notes
- Copyright
- Contents
- Table Index
- Figure Index
- Revision History
- 1Introduction
- 2Package Information
- 3Interface Application
- 3.1Power Supply
- Figure 5: VBAT voltage drop during burst emission
- 3.1.1Power Supply Design Guide
- Figure 6: Power supply application circuit
- Table 7: Recommended Zener diode list
- 3.1.2Recommended Power Supply Circuit
- Figure 7: Linear regulator reference circuit
- Figure 8: Switching mode power supply reference ci
- 3.1.3Voltage Monitor
- 3.2Power on/Power off/Reset Function
- 3.3UART Interface
- 3.4USB Interface
- 3.5USIM Interface
- 3.6PCM Interface
- 3.7SD Interface
- 3.8I2C Interface
- 3.9SDIO Interface
- 3.10SPI Interface
- 3.11Network status
- 3.12Flight Mode Control
- Switch
- 3.1Power Supply
- 4RF Specifications
- 5Electrical Specifications
- 6SMT Production Guide
- 7Packaging
- Appendix
SIM7600SA-H_User Manual_V1.00
2017-10-11
Smart Machine Smart Decision
4
72 hours
5
48 hours
5a
24 hours
6
Mandatory bake before use. After bake, it must be reflowed within the
time limit specified on the label.
NOTE: IPC / JEDEC J-STD-033 standard must be followed for production and storage.
6.3 Stencil Foil Design Recommendation
The recommended thickness of stencil foil is more than 0.15mm.