User's Manual

SIM7600G-H User manual
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LTE data
LTE-FDD B2
@5MHz 22.1dBm Typical: 676 ma
@10MHz 22.4dBm Typical: 723 ma
@20MHz 22.3dBm Typical: 759 ma
LTE-FDD B4
@5MHz 22.0dBm Typical: 709 ma
@10MHz 22.1dBm Typical:769 ma
@20MHz 22.6dBm Typical: 896 ma
LTE-FDD B5
@5MHz 22.2dBm Typical: 619 ma
@10MHz 22.1dBm Typical: 628 ma
LTE-FDD B12
@5MHz 22.7dBm Typical: 600 ma
@10MHz 22.7dBm Typical: 607 ma
LTE-FDD B13
@5MHz 21.9dBm Typical: 685 ma
@10MHz 22.0dBm Typical: 653 ma
LTE-FDD B25
@5MHz 22dBm Typical: 634 ma
@10MHz 22dBm Typical: 702 ma
@20MHz 22dBm Typical: 781 ma
LTE-FDD B26
@5MHz 22.4dBm Typical: 615 ma
@10MHz 22.7dBm Typical:664 ma
@15MHz 22.3dBm Typical:713 ma
LTE-FDD B66
@5MHz 22dBm Typical: 707ma
@10MHz 22dBm Typical: 728ma
@20MHz 22dBm Typical: 795 ma
LTE-TDD B41
@5MHz 21.6dBm Typical:803 ma
@10MHz 21.7dBm Typical: 771 ma
@20MHz 21.7dBm Typical: 793 ma
5.5 ESD Notes
MODULE is sensitive to ESD in the process of storage, transporting, and assembling. When MODULE is
mounted on the users’ mother board, the ESD components should be placed beside the connectors which
human body may touch, such as USIM card holder, audio jacks, switches, keys, etc. The following table
shows the MODULE ESD measurement performance without any external ESD component.
Table 37: The ESD performance measurement table (Temperature: 25
℃
, Humidity: 45%)
Part
Contact discharge
Air discharge
VBAT,GND
+/-5K
+/-10K
Antenna port
+/-4K
+/-8K
Other PADs
+/-0.5K
+/-1K