User's Manual
Table Of Contents
- Version History
- Contents
- Table Index
- Figure Index
- 1Introduction
- 2 Package Information
- 3 Interface Application
- 4 RF Specifications
- 5 Electrical Specification
- 6 SMT Production Guide
- 7 Packaging
- 8 Appendix
SIM7600G-H User manual
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Figure 41: The ramp-soak-spike reflow profile of MODULE
For more details about secondary SMT, please refer to the document [21].
6.4 Moisture Sensitivity Level (MSL)
MODULE is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033. If the
prescribed time limit is exceeded, users should bake MODULE for 192 hours in drying equipment (<5% RH)
at 40+5/-0°C, or 72 hours at 85+5/-5°C. Note that plastic tray is not heat-resistant, and only can be baked at
45° C.
Table 39: Moisture Sensitivity Level and Floor Life
Moisture Sensitivity
Level (MSL)
Floor Life (out of bag) at factory ambient≤30°C/60% RH or
as stated
1
Unlimited at ≦30℃/85% RH
2
1 year
2a
4 weeks
3
168 hours
4
72 hours
5
48 hours
5a
24 hours
6
Mandatory bake before use. After bake, it must be reflowed within the
time limit specified on the label.
NOTE
NOTE