Users Manual Part 2

SIM8260A_Hardware Design_V1.05
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Refer to “Module secondary-SMT-UGD” for more information about the module shipping and
manufacturing.
6.6 Moisture Sensitivity Level (MSL)
SIM8260A is susceptible to damage induced by absorbed moisture and high temperature. A package’s
moisture-sensitivity level (MSL) indicates its ability to withstand exposure after it is removed from its
shipment bag, while it is on the factory floor awaiting PCB installation. A low MSL rating is better than a high
rating; a low MSL device can be exposed on the factory floor longer than a high MSL device. All pertinent
MSL ratings are summarized as follows.
Table 74: MSL ratings summary
MSL
Out-of-bag floor life
Comments
1
Unlimited
≤+30°C /85% RH
2
1 year
≤+30°C /60% RH
2a
4 weeks
≤+30°C /60% RH
3
168 hours
≤+30°C /60% RH
4
72 hours
≤+30°C /60% RH
5
48 hours
≤+30°C /60% RH
5a
24 hours
≤+30°C /60% RH
6
Mandatory bake before use. After bake, it must be
reflowed within the time limit specified on the label.
≤+30°C /60% RH
The SIM8260A device samples are currently classified as MSL3 at 255 (+5, -0) °C, following the latest
IPC/JEDEC J-STD-020 standard revision for moisture-sensitivity qualification This qualification temperature
(255°C) should not be confused with the peak temperature within the recommended solder reflow profile.
NOTE