Specifications

Smart Machine Smart Decision
SIM5800_Hardware Design_V1.01 36 2018-10-08
16 Ω load f = 1 kHz, 0 dB gain
Output power
118
-
mW
SNR
90
-
dB(A)
THD @Pout=20mW
@Pout=100mW
-74
-70
dB
THD+N @Pout=20mW
@Pout=100mW
-74
-70
dB
4.12.2 MIC Interface
MIC
differential
signal
& shielded by
GND
Close to microphone
MIC1P
Module
MIC1N
ESD
ESD
10pF
33pF
33pF
33pF
10pF
10pF
MICBIAS0
PMIC
Figure 27: Reference citcuit of the MIC
4.12.3 Headset
Module integrated one way stereo headphone interface. Customers are advised to reserve ESD devices during the
design phase to prevent ESD damage.
The 139 pin of the module is the interrupt pin, through which the user can realize the insert and pull out detection
of the headset. Schematic diagram of headphone connection is as follows:
ESD
33pF
BEAD
BEAD
ESD ESD
33pF
BEAD
HPH_L
Module
HPH_R
470R
100R
100R
R
PMIC
MICBIAS1
EAR_MICP
HS-DET
47K
139
7
8
9
125
VIO18_PMU
470K
GND
470R
ESD
Figure 28: Reference circuit of headset
Note: the earphone seat in the figure is normally closed type. If the earphone seat used by the user is normally
open type, please modify the detection circuit and software according to the actual pin.
Table 14: Performance parameters of the headset