Specifications

Use of Analytical Module Hardware Test Box
This section provides describes the Module Hardware Tester device and
its use for troubleshooting Modular Oven Analytical Modules. The
Module Hardware Tester is used to check for leaks in a module and to
test the electrical characteristics of the Thermal Conductivity Detector
beads.
Description
The Module Hardware Tester is encased in a hard plastic carrying case
for mobility. It requires no outside power source. Requirements for
proper use of the device are as follows.
Requirements for Use
• Tool kit need to secure Analytical Module to the tester and to
fix any problems that may be found. To prevent leaks at the
manifold, a torque wrench is recommended (Siemens part
number A5E31368510)
• Clean, dry, and well ventilated area to use the device.
• Test meter (ohm meter or multimeter) for connecting to the
TCD bead test points.
• Gas supply, such as helium, capable of supplying up to 100
psi (690 kPa).
• Method of detecting leaks, such as a gas detecting
instrument (such as GOW-MAC®) or liquid detector (such as
Snoop®).
Exercise caution with gas supply, as failure to use in a properly vented
area could deplete oxygen supply.
Warning
When removing materials from the analyzer, all items must be placed on
a clean, non-abrasive surface. Use a clean lint-free cloth.
Important
The Module Hardware Tester should be stored with the MAIN VALVE set
to VENT and with both supplied blank manifold plates installed using the
M10 x 25 mm bolts supplied with the Tester.
Storage
4-36 A5E31405710001