Datasheet

Vybrid Power Consumption and Options, Rev. 0
8 Freescale Semiconductor
Power consumption in special cases
7.1 Consumption depending on Code placement
Hello world application – print on serial channel.
7.2 Consumption depending on frequency
The operating frequency has significant influence on the final power consumption. Higher frequency
applications require more current.
Dual core Hello world application – print on serial channel and LEDs blinking.
7.3 Idd current versus temperature
Smaller technology processes involve a higher dependency on temperature, mainly due to leakage
currents. Measured values are captured in the following table.
Temperature is measured 5mm from SoC package on the Vybrid tower module.
Hello world application – print on serial channel.
Table 8. Consumption depending on code placement
Code placement
Nominal
Voltage [V]
Current [mA] Power [mW] Note
SRAM 1.2 148 182 SRAM current included
SDRAM (DDR3) 1.5 + 3.3 184 + 106 = 290 227 +159 = 386 DDR3 memory consumption not
included ~100mA / 1.5V
QSPI 1.2 136 167 QSPI memory consumption not
included ~50mA / 3.3V
Table 9. Consumption depending on frequency
Cores Frequency
CA5/CM4 [MHz]
Vybrid Current 1.2V rail [mA] Power [mW]
399/133 156 192
450/150 172 212
500/166 187 230
Table 10. Temperature and Idd current
Temperature [°C] Idd 1.2V [mA]
25 260
65 310
70 320
80 343
85 355