Maintenance Manual Service Manual 1
Maintenance Manual Contents 1 H1822B Module Features ..............................................................................................................3 1.1 H1822B.......................................................................................................................................3 1.2 Basic Feature .............................................................................................................................3 1.3 Typical Application .............................
Maintenance Manual 1 H1822B Module Features 1.1 H1822B Figure 1.1: H1822B Module 1.2 Basic Feature Table 1-1: Feature Platform MTK MT6250D Band GSM850/GSM900/DCS1800/PCS1900 LCM CAMERA MCP Module 32Mbits Norflash+32Mbits pSRAM BT Module Internal FM RX Module Internal Audio PA Internal SIM Dual SIM I/O Micro USB 5PIN Torch Yes Keypad Yes 1.3 Typical Application Figure 1.3.
Maintenance Manual 4
Maintenance Manual 2 Mainboard overview Figure 2.11: top Figure 2.
Maintenance Manual 6
Maintenance Manual 3 Detailed Function Circuit 3.1 Download Module When item U200 (pin N17 KCOL0) status is LOW, program select download mode. Item U200 (pin N17 KCOL0) connects I/O or TEST point (BOOT_L).Program can be download through USB I/O or test point when BOO_L connects GND. Step 1. whether SMD component of D/L Circuit is correct, not damaged and missing; Step 2. whether PCB route is connecting; Step 3. whether IC U200 is damaged. Figure 3.1.1 BB IC D/L interface Figure 3.1.
Maintenance Manual 3.2 Audio Module 3.2.1 Micphone Circuit Figure 3.2.1 Micphone circuit Micphone connect U200 pin U1/U2 through CAP(C504/C512) and MICBIAS voltage is about 2.8volt. Step 1. whether SMD component of MIC Circuit is correct, not damaged and missing; Step 2. whether PCB route is connecting; Step 3. whether IC U200 is damaged.
Maintenance Manual 3.2.2 Receiver Circuit Figure 3.2.2 Receiver circuit Receiver connect U200 pin T4/U4 Step 1. whether SMD component of Receiver Circuit is correct, not damaged and missing; Step 2. whether IC U200 is damaged. 3.2.3 Speaker Circuit Figure 3.2.3: Speaker circuit Internal Audio PA(Class AB) is built-in BB IC chipset, which output power is no more than 0.7W. Step 1. whether SMD component of SPK Circuit is correct, not damaged and missing; Step 2. whether PCB route is connecting; Step 3.
Maintenance Manual 3.3 FM Module 3.3.1 FM Circuit Figure 3.3.1 FM circuit (built-in) Step 1. whether SMD peripheral component of FM is correct, not damaged and missing; Step 2. whether PCB route is connecting; Step 3. whether IC U200 is damaged. 3.4 BT Module Internal BT module ,this module built-in U200-baseband chipset. Figure 3.4.
Maintenance Manual 3.5 ATV Module NONE 3.6 WIFI Module NONE 3.7 RF Module RF Module, type HS8269L, item U101 Figure 3.7.1 RF Front-end Module RF PA is the probability of the most original failure, common faults include: no network, no signal, the signal is weak, only dial emergency calls, etc. Step 1. whether GSM antenna is correctly placed according to guide; Step 2. whether SMD peripheral component of RF PA is correct, not damaged and missing; Step 3. whether PCB route is connecting;; Step 5.
Maintenance Manual 3.8 LCM Module Figure 3.8.1 24PIN_ LCM interface LCM interface is a channel connecting the motherboard and the screen, generally will not be bad, only when improper welding operation. Note that control iron welding temperature.
Maintenance Manual 3.9 CAMERA MODULE Figure 3.9.1 CAMERA CAMERA interface is connected to the motherboard and the camera position when welding OK, then, will not cause camera failure Note that the temperature control soldering iron.
Maintenance Manual 3.10 KEYPAD interface Figure 3.9.
Maintenance Manual 4 Fault Maintenance 4.1 RF Part Refer to function circuit Part 3.7 4.2 BB Part Refer to function circuit FCC Statement 1. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference. (2) This device must accept any interference received, including interference that may cause undesired operation. 2.
