User's Guide

6310™ Application Ready Platform (SYS6310) User Guide Hardware Specification
003829 Rev A MAY CONTAIN U.S. AND INTERNATIONAL EXPORT CONTROLLED INFORMATION 2
Confidential and Proprietary – SMART Wireless Computing, Inc.
Provided under NDA
2. HARDWARE SPECIFICATION
2.1 INTRODUCTION
The 6310
TM
Application Ready Platform (SYS6310) can be used to develop, test, and deploy end-user
product solutions around Qualcomm Snapdragon SDA450 processor.
2.2 SYSTEM SPECIFICATION
The following table shows the hardware specification of the 6310
TM
Application Ready
Platform (SYS6310)
Table 1: 6310 Application Ready Platform (SYS6310) Specifications
Processor
Processor
Qualcomm® Snapdragon™450 Processor (14mm×12mm package)
Memory
eMCP (16 GB eMMC + 2 GB LPDDR3)
SBC I/O Interfaces
Interfaces
1× uUSB v2.0 (Device), 2× USB v3.0 (Host), 1× HDMI Type D, 1× RJ45,1xMicro SD Card slot
Form Factor
Mechanical
109.05mm x 70.07mm x 30.02mm
Power
Power Input
12V via DC Jack
Others
Temperature
Specification
0C to +40C