Data Sheet

ICM-20948

Document Number: DS-000189 Page 9 of 89

Revision: 1.3

1 GENERAL DESCRIPTION

1.1 PURPOSE AND SCOPE

This document is a preliminary data sheet, providing a description, specifications, and design related information on

the ICM-20948 MotionTracking device.

For references to register map and descriptions of individual registers, please refer to the ICM-20948 Register Map

and Register Descriptions document.

1.2 PRODUCT OVERVIEW

The ICM-20948 is a multi-chip module (MCM) consisting of two dies integrated into a single QFN package. One die

houses a 3-axis gyroscope, a 3-axis accelerometer, and a Digital Motion Processor™ (DMP). The other die houses the

AK09916 3-axis magnetometer from Asahi Kasei Microdevices Corporation. The ICM-20948 is a 9-axis MotionTracking

device all in a small 3x3x1mm QFN package. The device supports the following features:

• FIFO of size 512 bytes (FIFO size will vary depending on DMP feature-set)

• Runtime Calibration

• Enhanced FSYNC functionality to improve timing for applications like EIS

ICM-20948 devices, with their 9-axis integration, on-chip DMP, and run-time calibration firmware, enable

manufacturers to eliminate the costly and complex selection, qualification, and system level integration of discrete

devices, guaranteeing optimal motion performance for consumers.

The gyroscope has a programmable full-scale range of ±250 dps, ±500 dps, ±1000 dps, and ±2000 dps. The

accelerometer has a user-programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g. Factory-calibrated

initial sensitivity of both sensors reduces production-line calibration requirements.

Other key features include on-chip 16-bit ADCs, programmable digital filters, an embedded temperature sensor, and

programmable interrupts. The device features I

C and SPI serial interfaces, a VDD operating range of 1.71V to 3.6V,

and a separate digital IO supply, VDDIO from 1.71V to 1.95V.

Communication with all registers of the device is performed using I

C at up to 100 kHz (standard-mode) or up to

400 kHz (fast-mode), or SPI at up to 7 MHz.

By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS wafers with

companion CMOS electronics through wafer-level bonding, InvenSense has driven the package size down to a

footprint and thickness of 3 mm x 3 mm x 1 mm (24-pin QFN), to provide a very small yet high-performance, low-cost

package. The device provides high robustness by supporting 20,000g shock reliability.

1.3 APPLICATIONS

• Smartphones and Tablets

• Wearable Sensors

• IoT Applications

• Drones