Data Sheet

Page 38 ams Datasheet
Document Feedback [v1-01] 2017-Mar-17
AS7262 − Soldering & Storage Information
Soldering Information
The module has been tested and has demonstrated an ability
to be reflow soldered to a PCB substrate. The solder reflow
profile describes the expected maximum heat exposure of
components during the solder reflow process of product on a
PCB. Temperature is measured on top of component. The
components should be limited to a maximum of three passes
through this solder reflow profile.
Figure 37:
Solder Reflow Profile
Figure 38:
Solder Reflow Profile Graph
Parameter Reference Device
Average temperature gradient in preheating 2.5°C/s
Soak time
t
SOAK
2 to 3 minutes
Time above 217°C(T
1
)t
1
Max 60s
Time above 230°C(T
2
)t
2
Max 50s
Time above T
peak
- 10°C(T
3
)t
3
Max 10s
Peak temperature in reflow
T
peak
260°C
Temperature gradient in cooling Max -5°C/s
Soldering & Storage
Information