User's Manual
Table Of Contents
- 1. General Description
- 2. Installation and Operation
- 3. Options
- 3.1 T01 Programmable Channel Spacing
- 3.2 T02 Programmable CTCSS encoder/decoder
- 3.3 T03 Programmable DCS/CTCSS encoder/decoder
- 3.4 T05 Balanced and Isolated VF plus E&M
- 3.5 T06 Simplex Changeover Relay
- 3.6 T08 VF Delay
- 3.7 T09 300Hz Upgrade HPF Filter
- 3.8 T10 Power Save Mode
- 3.9 T11 Combined Options
- 3.10 T12 External Reference Oscillator Input
- 3.11 T13 Local Speaker, Mic Socket and Front Panel Mute
- 3.12 T14 Local Channel Change
- 3.13 T16 1PPM Frequency Stability
- 3.14 U69 Extended Temperature Range Verification
- 3.15 T19/26 Line Interface Board.
- 3.16 T29 Balanced and Isolated VF plus E&M
- 3.17 T31 Network Adapter
- 3.18 T34 Ethernet option
- 3.19 T36 Option - TX Ref Oscillator input and Modulator
- 6. MX800 Base Station Fault Finding Procedure
- 7. Appendices
- 7.1 MX800 Interface Connections
- 7.2 CN2 DB9 Female Monitor Connector
- 7.3 CN3 DB25 Female Digital I/O Connector
- 7.4 MX800 Specifications
- 7.5 Channel Select DIP Switch Settings
- 7.6 MX800 Model Number Configuration Guide
- 7.7 MX800 System Applications
- 7.7.1 Conventional base station/repeater
- 7.7.2 Link transceiver
- 7.7.3 Data transceiver
- 7.7.4 Paging transmitter
- 7.7.5 Trunking Base Station
- 7.7.6 Systems base
- 7.7.7 Repeater with Morse ID
- 7.7.8 Simplex base station
- 7.7.9 Duplicated base station
- 7.7.10 Power Save base station
- 7.7.11 Tone key base station
- 7.7.12 Voting base station
- 7.7.13 Simulcast base station
- 8. Superseded Technical Information
- 9. Drawings
MX800 Transceiver General Description
1.2.2 Receiver Module
The receiver module accepts the low level RF input signal and amplifies,
filters and conditions the signal prior to detecting the wanted audio
component. The Receiver module features the same advanced synthesiser and
wide bandwidth as the exciter. Only the front-end Bandpass filter and VCO
need to be changed in order to support different frequency bands, resulting in
significant flexibility and end-user cost savings. The purpose built front end
Bandpass filter has a wide no-adjust bandwidth equal to the band allocation
(refer to section 7.4 for details of the band allocations).
The receiver has high sensitivity while maintaining excellent Intermodulation
immunity and adjacent channel rejection. A dual first IF filter provides
excellent rejection to common known spurious responses. High blocking of
over 100dB typical ensures that strong interfering signals do not desensitise
the receiver when receiving weak signals.
1.2.3 Power Amplifier Module
RF from the Exciter passes via a coaxial cable to the input of the PA Module
and is first attenuated by a 50 ohm pad, which is used to provide a good
50 ohm source impedance for the first LDMOS driver amplifier. The RF is
amplified to around 5 Watts at the driver output, and is band dependant. Note:
this point does not have 50 ohm impedance and the drive power cannot be
measured directly with a 50 ohm Wattmeter. The signal from the driver is
then matched by a broadband network to drive the low input impedance
associated with the final transmit LDMOS power amplifier transistor. The
transistor's low Drain impedance is then also matched back to 50 ohms by a
broadband matching network covering a very wide bandwidth. Prior to
transmission, a low loss 13 element elliptical low pass filter, filters out the
unwanted harmonics to less than –90 dBc.
A dual directional coupler consists of coupled microstrip transmission lines
fabricated on the PCB artwork. The sampled RF energy is rectified to provide
a proportional DC voltage output.
The PTT signal enables the amplifier circuit by providing bias to the
transistors. A thermistor TS1, physically located on the PA heatsink monitors
the heatsink’s temperature and is monitored by the Micro Controller.
The PA is very compact and efficient for high reliability and low cost. The
heatsink has minimal temperature rise even under continuous operation,
ensuring the best MTBF obtainable for a practical design.
© SPECTRA ENGINEERING 2008 Revision 4.3.1B
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