Data Sheet

SPNYL01-X Bluetooth module datasheet
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10.2.1. Radio Equipment Directive (RED) 2014/53/EU
The SPNYL01-X module complies with the essential requirements and other relevant provisions of
Radio Equipment Directive (RED) 2014/53/EU.
10.2.2. Labelling and user information requirements
The label on the final products which contain the SPNYL01-X module must follow CE marking
requirements. The “R&TTE Compliance
11. Cautions
11.1 Reflow soldering
Reflow soldering is a vitally important step in the SMT process. The temperature curve associated
with the reflow is an essential parameter to control to ensure the correct connection of parts. The
parameters of certain components will also directly impact the temperature curve selected for this
step in the process.
• The standard reflow profile has four zones: ①preheat, ②soak, ③reflow, ④cooling. The profile
describes the ideal temperature curve of the top layer of the PCB.
• During reflow, modules should not be above 260°C and not for more than 30 seconds.