User's Manual

Doc ID TBD Rev 0.8 Rev 0.1
13/19
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3.5 Module reflow installation
The SP1ML is a surface mount module supplied on a 16-pin, 4-layer PCB. The final
assembly recommended reflow profile is indicated below, based on IPC/JEDEC JSTD-
020C, July 2004 recommendations.
Table 8. Soldering profile
Profile feature
Lead-free assembly
Average ramp-up rate (TSMAX to TP)
3 °C/sec max
Preheat:
– Temperature min. (TS min.)
– Temperature max. (TS max.)
– Time (ts min. to ts max.)(ts)
150 °C
200 °C
60-100 sec
Time maintained above:
– Temperature TL
– Temperature TL
217 °C
60-70 sec
Peak temperature (TP)
240 °C
Time within 5 °C of actual peak temperature (TP)
10-20 sec
Ramp-down rate
6 °C/sec
Time from 25 °C to peak temperature
8 minutes max.
Figure 6. Soldering profile