Data Sheet

SPBTLE-1S
Rev 0.1 P a g e | 2 30
Contents
1 General description ................................................................................... 4
2 Block diagram ............................................................................................ 5
3 Software Development .............................................................................. 6
3.1 Software development Kit ............................................................................. 6
3.2 Software Architecture ................................................................................... 6
4 Hardware specifications ........................................................................... 8
4.1 Absolute maximum ratings ........................................................................... 8
4.2 Recommended operating conditions ............................................................ 8
4.3 Current consumption .................................................................................... 8
4.4 Pin assignment ............................................................................................. 9
4.5 Mechanical dimensions .............................................................................. 11
5 Hardware design ......................................................................................12
5.1 Reset Circuitry ............................................................................................ 12
5.2 Debug Interface .......................................................................................... 12
5.3 Reflow soldering ......................................................................................... 13
6 Regulatory compliance ............................................................................15
6.1 FCC certification ......................................................................................... 15
6.1.1 Labeling instructions................................................................................................. 15
6.1.2 Product manual instructions ..................................................................................... 16
6.2 IC certification ............................................................................................ 17
6.2.1 Labeling instructions................................................................................................. 17
6.2.2 Product manual instructions ..................................................................................... 18
6.3 EU Type approval for SPBTLE-1S module ................................................. 19
6.4 Bluetooth certification ................................................................................. 19
7 Ordering information ................................................................................27
8 ECOPACK
®
................................................................................................28