User's Manual

February 2017
DocID0xxxxx Rev 0.xx 19/27
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. ww w.st.com
3.5 Module reflow installation
SPSGPE is a surface mount module supplied on a 46-pin, 6-layer PCB, with gold surface finish. Final
assembly recommended reflow profile is outlined below, based on IPC/JEDEC JSTD-020C, July 2004
recommendations.
Profile feature
Lead-free assembly
Average ramp-up rate (T
SMAX
to T
P
)
1.7°C/sec max
Preheat:
- Temperature min (T
S
min.)
- Temperature max (T
S
max.)
- Time (T
S
min. to T
S
max.) (t
S
)
150°C
200°C
60-100 sec (suggested: 85 sec)
Time maintained above:
- Temperature T
L
- Temperature T
L
217 °C
60-100 sec (suggested: 99 sec)
Peak temperature (T
P
)
242 °C
Time within 5°C of actual peak temperature (T
P
)
10-20 sec
Ramp-down rate
2°C/sec
Time from 25°C to peak temperature
8 minutes max.
Table 12. Soldering profile.
Figure 6. Soldering profile.