User's Manual

List of tables
February 2017
DocID0xxxxx Rev 0.xx 2/27
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change
without notice. ww w.st.com
Contents
1 Description .............................................................................................................................. 5
2 Hardware specifications........................................................................................................... 6
2.1 Recommended operating conditions .................................................................................. 6
2.2 Absolute maximum ratings ................................................................................................. 6
2.3 I/O operating specifications ................................................................................................ 6
2.4 Current consumption .......................................................................................................... 7
2.5 RF compliance limits .......................................................................................................... 7
2.6 RF sensitivity data .............................................................................................................. 8
2.7 Pin assignment ................................................................................................................... 9
2.8 Pin placement................................................................................................................... 10
2.9 Memory resources ............................................................................................................ 11
2.10 Hardware block diagram ............................................................................................... 11
3 Hardware design ................................................................................................................... 12
3.1 Pin usage ......................................................................................................................... 12
3.2 Typical application circuits ................................................................................................ 13
3.3 Layout guidelines ............................................................................................................. 16
3.4 Recommended footprint ................................................................................................... 18
3.5 Module reflow installation ................................................................................................. 19
4 Module operation ................................................................................................................... 20
5 Package mechanical data ...................................................................................................... 21
6 Regulatory compliance .......................................................................................................... 22
6.1 CE certification ................................................................................................................. 22
6.2 FCC certification ............................................................................................................... 22
6.3 IC certification................................................................................................................... 22
6.4 Labeling instructions ......................................................................................................... 23
6.5 Product manual instructions ............................................................................................. 24
7 Ordering information .............................................................................................................. 25
Appendix 1 Document revision history ........................................................................................ 26