Datasheet

ManualsBrandsST ManualsDiodesSchottky Diode, 70mA, 70V, SOD-323

October 2009 Doc ID 12563 Rev 2 1/14

BAS70

Low capacitance, low series inductance and resistance Schottky diodes

Features

■ Very low conduction losses

■ Negligible switching losses

■ Low forward and reverse recovery times

■ Surface mount device

■ Low capacitance diode

■ Low resistance and inductance

Description

The BAS70 series uses 70 V Schottky barrier

diodes packaged in SOD-123, SOD-323, SOD-

523, SOT-23, SOT-323, SOT-323-6L or SOT-666.

These diodes are specially suited for signal

detection and temperature compensation in RF

applications.

Table 1. Device summary

Symbol Value

70 mA

RRM

70 V

(max) 2 pF

(max) 150 °C

SOD-323

SOD-523

SOT-23

SOT-666

BAS70JFILM

(Single)

BAS70KFILM

(Single)

BAS70FILM

(Single)

BAS70-04FILM

(Series)

BAS70-05FILM

(Common cathode)

BAS70WFILM

(Single)

BAS70-05WFILM

(Common cathode)

BAS70-06WFILM

(Common anode)

BAS70-04WFILM

(Series)

BAS70-07P6FILM

(2 parallel diodes)

BAS70-08SFILM

(3 parallel diodes)

BAS70-09P6FILM

(2 opposite diodes)

BAS70-06FILM

(Common anode)

SOT-323

SOT-323-6L

Configurations in top view

SOD-123

BAS70ZFILM

(Single)

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Summary of content (14 pages)

PAGE 1
BAS70 Low capacitance, low series inductance and resistance Schottky diodes Features ■ ■ ■ ■ ■ ■ BAS70ZFILM (Single) Very low conduction losses Negligible switching losses Low forward and reverse recovery times Surface mount device Low capacitance diode Low resistance and inductance SOD-123 BAS70JFILM (Single) SOD-323 BAS70KFILM (Single) Description SOD-523 BAS70FILM (Single) The BAS70 series uses 70 V Schottky barrier diodes packaged in SOD-123, SOD-323, SOD523, SOT-23, SOT-323, SOT-323-6L or SOT-
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Characteristics 1 BAS70 Characteristics Table 2. Absolute ratings (limiting values at Tj = 25 °C, unless otherwise specified) Symbol Value Unit Repetitive peak reverse voltage 70 V Continuous forward current 70 mA IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 1 A Tstg Storage temperature range - 65 to +150 °C VRRM IF Parameter Tj Maximum operating junction temperature 150 °C TL Maximum soldering temperature 260 °C Value Unit Table 3.
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BAS70 Characteristics Figure 1. Average forward power dissipation Figure 2. versus average forward current Average forward current versus ambient temperature (δ = 1) IF(AV)(A) P(W) 0.08 0.14 d=0.05 d=0.2 d=0.1 d=0.5 d=1 0.07 0.12 0.06 0.10 0.05 0.08 0.04 0.06 0.03 T T 0.04 0.02 0.02 0.01 tp d=tp/T IF(AV)(A) tp d=tp/T T amb (°C) 0.00 0.00 0.00 0.01 Figure 3. 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.
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Characteristics Figure 7. 1.E+02 BAS70 Forward voltage drop versus forward current (typical values) Figure 8. IFM(mA) 1000 Differential forward resistance versus forward current (typical values) RF (Ω) F=100 MHz Tj=25 °C Tj=125 °C Tj=25 °C 1.E+01 100 1.E+00 VFM(V) 1.E-01 Figure 9. 1000 IF(mA) 10 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 Relative variation of thermal impedance junction to ambient versus pulse duration 0.1 1.0 10.0 Figure 10.
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BAS70 Ordering information scheme Figure 13. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 14. Thermal impedance junction to ambient versus copper surface under each lead Zth(j-a) /Rth(j-a) Rth(j-a) (°C/W) 600 1.00 printed circuit board, epoxy FR4 eCU = 35 µm SOD-323 Single pulse SOD-523 550 EpoxyFR4 eCU=35 µm 0.10 500 450 400 0.01 350 printed circuit board, epoxy FR4 eCU = 35 µm SOD-523 0.00 1.E-03 2 1.E-02 1.E-01 1.E+00 tP(s) 1.
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Package information 3 BAS70 Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. SOD-123 dimensions Dimensions Ref. H Millimeters Inches A2 A1 Min. b A E D A Max. Min. 1.45 Max. 0.
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BAS70 Package information Table 7. SOD-323 dimensions Dimensions H A1 Ref. b Millimeters Min. E A A D c Q1 L Max. Inches Min. 1.17 Max. 0.046 A1 0 0.1 0 0.004 b 0.25 0.44 0.01 0.017 c 0.1 0.25 0.004 0.01 D 1.52 1.8 0.06 0.071 E 1.11 1.45 0.044 0.057 H 2.3 2.7 0.09 0.106 L 0.1 0.46 0.004 0.02 Q1 0.1 0.41 0.004 0.016 Figure 17. SOD-323 footprint (dimensions in mm) 3.20 0.54 1.06 1.08 1.
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Package information Table 8. BAS70 SOD-523 dimensions Dimensions E Ref. 0.15 M C A B E1 B D 2xb 0.20 M C A B Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.50 0.60 0.70 0.020 0.024 0.028 E 1.50 1.60 1.70 0.059 0.063 0.067 E1 1.10 1.20 1.30 0.043 0.047 0.051 D 0.70 0.80 0.90 0.028 0.031 0.035 b 0.25 0.35 0.010 0.014 c 0.07 0.20 0.003 0.008 L 0.15 0.25 0.006 0.008 0.010 L1 0.05 0.20 0.002 A 8° R0.1 A c SEATING PLANE C 7° L L1 Figure 18.
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BAS70 Package information Table 9. SOT-23 dimensions Dimensions Ref. Millimeters Min. Max. Min. Max. A 0.89 1.4 0.035 0.055 A1 0 0.1 0 0.004 B 0.3 0.51 0.012 0.02 c 0.085 0.18 0.003 0.007 D 2.75 3.04 0.108 0.12 e 0.85 1.05 0.033 0.041 e1 1.7 2.1 0.067 0.083 E 1.2 1.6 0.047 0.063 H 2.1 2.75 0.083 0.108 A E e B D e1 S A1 L Inches c H L 0.6 typ. S 0.35 0.024 typ. 0.65 0.014 0.026 Figure 19. SOT-23 footprint (dimensions in mm) 0.95 0.61 1.
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Package information BAS70 Table 10. SOT-323 dimensions Dimensions Ref. A E Millimeters Min. e Typ. Inches Max. Min. Typ. Max. A 0.8 1.1 0.031 0.043 A1 0.0 0.1 0.0 0.004 b 0.25 0.4 0.010 0.016 c 0.1 0.26 0.004 0.010 D 1.8 2.0 2.2 0.071 0.079 0.086 E 1.15 1.25 1.35 0.045 0.049 0.053 D b A1 e c θ L 0.65 0.026 H 1.8 2.1 2.4 0.071 0.083 0.094 L 0.1 0.2 0.3 0.004 0.008 0.012 q 0 30° 0 H Figure 20. SOT-323 footprint (dimensions in mm) 0.
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BAS70 Package information Table 11. SOT323-6L dimensions Dimensions A Ref. Millimeters Inches E e b Min. Max. Min. Max. A 0.8 1.1 0.031 0.043 A1 0 0.1 0 0.004 A2 0.8 1 0.031 0.039 b 0.15 0.3 0.006 0.012 c 0.1 0.18 0.004 0.007 D 1.8 2.2 0.071 0.086 E 1.15 1.35 0.045 0.053 D e A1 A2 Q1 e c L HE 0.65 Typ. 0.025 Typ. H 1.8 2.4 0.071 0.094 Q 0.1 0.4 0.004 0.016 Figure 21. SOT323-6L footprint (dimensions in mm) 0.65 1.05 2.9 0.80 1.05 0.
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Package information BAS70 Table 12. SOT-666 dimensions Dimensions b1 Ref. Millimeters Inches L1 Min. Typ. Max. Min. Typ. Max. A 0.45 0.60 0.018 0.024 A3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 D 1.50 1.70 0.059 0.067 E 1.50 1.70 0.059 0.067 E1 1.10 1.30 0.043 0.051 L3 b D E1 0.27 0.34 0.007 0.011 0.013 A L2 E A3 e 0.50 0.020 L1 0.19 0.007 L2 0.10 0.30 0.004 0.012 e L3 0.10 Figure 22. SOT-666 footprint (dimensions in mm) 0.50 0.62 0.
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BAS70 4 Ordering information Ordering information Table 13.
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BAS70 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.