Datasheet

ManualsBrandsST ManualsDiodesSchottky Diode, 1A, 23V, SOD-323

1/5

BAT20J

April 2004 - Ed: 1

HIGH EFFICIENCY SWITCHING AND

ULTRA LOW LEAKAGE CURRENT SCHOTTKY DIODE

■

Low conduction losses

■

Very low reverse current

■

Negligible switching losses

■

Low capacitance diode

■

Low forward and reverse recovery times

■

Extremely fast switching

■

Surface mount device

FEATURES AND BENEFITS

The BAT20J is using 23V schottky barrier diode

encapsulated on a SOD-323 package. This is spe-

cially suited for switching mode in mobile phone

and PDA power management applications or LED

driver circuits (step up converters).

DESCRIPTION

SOD-323

Symbol Parameter Value Unit

RRM

Repetitive peak reverse voltage 23 V

F(RMS)

Repetitive peak forward current 2 A

F(AV)

Average forward current δ = 0.38 1 A

FSM

Surge non repetitive forward current (t

=10ms sinusoidal) 5 A

stg

Maximum storage temperature range - 65 to +150 °C

Tj Maximum operating junction temperature * 150 °C

TL Maximum temperature for soldering during * 260 °C

ABSOLUTE RATINGS (limiting values)

dPtot

dTj Rth j a

−

()

thermal runaway condition for a diode on its own heatsink

F(AV)

RRM

23 V

25°C(max) @ 15V 12 µA

Tj (max) 150 °C

MAIN PRODUCT CHARACTERISTICS

Part Number Marking

BAT20JFILM 20

Order code

Summary of content (5 pages)

PAGE 1
BAT20J ® HIGH EFFICIENCY SWITCHING AND ULTRA LOW LEAKAGE CURRENT SCHOTTKY DIODE MAIN PRODUCT CHARACTERISTICS IF(AV) 1A VRRM 23 V IR 25°C(max) @ 15V 12 µA Tj (max) 150 °C A FEATURES AND BENEFITS Low conduction losses Very low reverse current Negligible switching losses Low capacitance diode Low forward and reverse recovery times Extremely fast switching Surface mount device K ■ SOD-323 ■ ■ ■ ■ ■ ■ DESCRIPTION The BAT20J is using 23V schottky barrier diode encapsulated on a SOD-323 package.
PAGE 2
BAT20J THERMAL RESISTANCE Symbol Rth (j-a) Parameter Junction to Ambient (*) Value Unit 600 °C/W (*) Mounted on epoxy board without copper heat sink. STATIC ELECTRICAL CHARACTERISTICS Symbol Parameters IR * Reverse leakage current (see note 1) Tj = 25°C IR * Reverse leakage current Forward voltage drop VF ** Tests conditions Min. Typ. Max. Unit VR = 5 V VR = 8 V VR = 15 V 0.65 0.88 3.
PAGE 3
BAT20J Fig. 1: Peak forward current versus ambient temperature (δ = 0.11). Fig. 2: Average forward current versus ambient temperature ( δ = 0.5). IF(AV)(A) IP(A) 0.40 3.0 Printed circuit board FR4 SCU=2.25mm2 2.5 Printed circuit board FR4 SCU=2.25mm2 0.35 0.30 2.0 0.25 0.20 1.5 0.15 1.0 0.10 T 0.5 δ=tp/T 0.0 0 0.05 Tamb(°C) tp T δ=tp/T 0.00 25 50 75 100 125 150 Fig. 3: Relative variation of thermal impedance junction to ambient versus pulse duration .
PAGE 4
BAT20J Fig. 7-1: Forward voltage drop versus forward current (typical values, high level). Fig. 7-2: Forward voltage drop versus forward current (low level). IFM(A) IFM(A) 1.0 1.E+01 0.9 Tj=150°C Tj=150°C (typical values) 0.8 1.E+00 0.7 1.E-01 0.6 Tj=85°C Tj=85°C (typical values) Tj=25°C (typical values) 0.5 1.E-02 0.4 0.3 Tj=25°C 1.E-03 Tj=25°C (maximum values) 0.2 0.1 VFM(V) 1.E-04 VFM(V) 0.0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 Fig.
PAGE 5
BAT20J PACKAGE MECHANICAL DATA SOD-323 DIMENSIONS H A1 REF. b Min. A E A D c Q1 L ■ Millimeters Max. Inches Min. 1.13 Max. 0.045 A1 0 0.1 0 0.004 b 0.25 0.44 0.01 0.017 c 0.1 0.25 0.004 0.01 D 1.52 1.8 0.06 0.071 E 1.11 1.35 0.044 0.053 H 2.3 2.7 0.09 0.106 L 0.1 0.46 0.004 0.02 Q1 0.1 0.41 0.004 0.016 Ordering type Marking Package Weight Base qty Delivery mode BAT20JFILM 20 SOD-323 0.