Datasheet

ManualsBrandsST ManualsDiscrete SemiconductorsTriac, TO-220AB, 600V, 8A

1/11

Table 1: Main Features

DESCRIPTION

Available either in through-hole or surface-mount

packages, the BTA08, BTB08 and T8 triac series

is suitable for general purpose AC switching. They

can be used as an ON/OFF function in applica-

tions such as static relays, heating regulation, in-

duction motor starting circuits... or for phase

control operation in light dimmers, motor speed

controllers,...

The snubberless versions (BTA/BTB...W and T8

series) are specially recommended for use on

inductive loads, thanks to their high commutation

performances.

Logic level versions are designed to interface

directly with low power drivers such as

microcontrollers.

By using an internal ceramic pad, the BTA series

provides voltage insulated tab (rated at

2500V

RMS

) complying with UL standards (file ref.:

E81734).

Symbol Value Unit

T(RMS)

DRM

RRM

600 and 800 V

GT (Q

)

5 to 50 mA

BTA08, BTB08 and T8 Series

8A TRIACS

REV. 6February 2006

SNUBBERLESS™, LOGIC LEVEL & STANDARD

Table 2: Order Codes

Part Number Marking

BTA08-xxxxxRG

See page table 8 on

page 10

BTB08-xxxxxRG

T8xx-xxxG

T8xx-xxxH

T8xx-xxxB

PAK

(T8-G)

TO-220AB Insulated

(BTA08)

TO-220AB

(BTB08)

IPAK

(T8-H)

DPAK

(T8-B)

Summary of content (11 pages)

PAGE 1
BTA08, BTB08 and T8 Series ® 8A TRIACS SNUBBERLESS™, LOGIC LEVEL & STANDARD Table 1: Main Features A2 Symbol Value Unit IT(RMS) 8 A VDRM/VRRM 600 and 800 V IGT (Q1) 5 to 50 mA G A1 A2 A2 A1 A2 A1 A2 G G DESCRIPTION Available either in through-hole or surface-mount packages, the BTA08, BTB08 and T8 triac series is suitable for general purpose AC switching.
PAGE 2
BTA08, BTB08 and T8 Series Table 3: Absolute Maximum Ratings Symbol IT(RMS) Parameter RMS on-state current (full sine wave) tp = 10 ms dI/dt Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns F = 120 Hz IGM Peak gate current tp = 20 µs PG(AV) Tstg Tj 8 A Tc = 100°C Non repetitive surge peak on-state F = 50 Hz current (full cycle, Tj initial = 25°C) F = 60 Hz I²t Value for fusing I²t Unit IPAK/D2PAK/ T = 110°C DPAK/TO-220AB c TO-220AB Ins.
PAGE 3
BTA08, BTB08 and T8 Series ■ Standard (4 quadrants) Symbol IGT (1) Quadrant RL = 30 Ω I - II - III IV MAX. ALL MAX. 1.3 V ALL MIN. 0.2 V VD = 12 V VGT VGD VD = VDRM RL = 3.3 kΩ Tj = 125°C IH (2) IT = 500 mA IL IG = 1.2 IGT dV/dt (2) BTA08 / BTB08 Test Conditions MAX. I - III - IV II VD = 67 %VDRM gate open Tj = 125°C (dV/dt)c (2) (dI/dt)c = 5.3 A/ms Tj = 125°C C B 25 50 50 100 Unit mA 25 50 40 50 80 100 MIN. 200 400 V/µs MIN. 5 10 V/µs MAX.
PAGE 4
BTA08, BTB08 and T8 Series Figure 1: Maximum power dissipation versus RMS on-state current (full cycle) Figure 2: RMS on-state current versus case temperature (full cycle) P(W) IT(RMS)(A) 10 10 9 9 8 8 7 7 6 6 5 5 4 4 3 3 2 2 1 BTB / T8 BTA 1 IT(RMS)(A) TC(°C) 0 0 0 1 2 3 4 5 6 7 0 8 Figure 3: RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35µm) (full cycle) 25 50 75 100 125 Figure 4: Relative variation of thermal im
PAGE 5
BTA08, BTB08 and T8 Series Figure 7: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t 2 Figure 8: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values) IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 2 ITSM(A), I t (A s) 2.5 1000 Tj initial=25°C 2.0 IGT dI/dt limitation: 50A/µs ITSM 1.5 100 IH & IL 1.0 I2t 0.5 Tj(°C) tp(ms) 10 0.01 0.0 0.10 1.00 10.
PAGE 6
BTA08, BTB08 and T8 Series Figure 13: Ordering Information Scheme (BTA08 and BTB08 series) BT A 08 - 600 BW (RG) Triac series Insulation A = insulated B = non insulated Current 08 = 8A Voltage 600 = 600V 800 = 800V Sensitivity and type B = 50mA Standard C = 25mA Standard SW = 10mA Logic Level BW = 50mA Snubberless CW = 35mA Snubberless TW = 5mA Logic Level Packing mode RG = Tube Figure 14: Ordering Information Scheme (T8 series) T 8 10 - 600 B (-TR) Triac series Current 8 = 8A Sensitivity 10 = 10mA 35 =
PAGE 7
BTA08, BTB08 and T8 Series Figure 15: D2PAK Package Mechanical Data DIMENSIONS REF. E C2 L2 D L L3 A1 B2 R C Millimeters Min. A B G A2 2mm min. FLAT ZONE V2 Typ. Inches Max. Min. Typ. Max. A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.25 C 0.45 0.60 0.017 C2 1.21 1.36 0.047 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.28 0.393 0.405 G 4.88 5.28 0.192 0.208 1.40 0.048 0.055 0.024 L 15.00 15.85 0.
PAGE 8
BTA08, BTB08 and T8 Series Figure 17: DPAK Package Mechanical Data DIMENSIONS REF. E A B2 C2 L2 D R H L4 A1 B R G C A2 V2 Figure 18: DPAK Foot Print Dimensions (in millimeters) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 8/11 Inches Max Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.
PAGE 9
BTA08, BTB08 and T8 Series Figure 19: TO-220AB Package Mechanical Data REF. C B ØI b2 L F A I4 l3 c2 a1 l2 a2 M c1 b1 e A a1 a2 B b1 b2 C c1 c2 e F ØI I4 L l2 l3 M DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 15.20 15.90 0.598 3.75 0.147 13.00 14.00 0.511 10.00 10.40 0.393 0.61 0.88 0.024 1.23 1.32 0.048 4.40 4.60 0.173 0.49 0.70 0.019 2.40 2.72 0.094 2.40 2.70 0.094 6.20 6.60 0.244 3.75 3.85 0.147 15.80 16.40 16.80 0.622 0.646 2.65 2.95 0.104 1.14 1.70 0.044 1.14 1.70 0.044 2.60 0.
PAGE 10
BTA08, BTB08 and T8 Series In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
PAGE 11
BTA08, BTB08 and T8 Series Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice.