Datasheet

ManualsBrandsST ManualsDiscrete SemiconductorsDarlington Transistor, NPN, 350V, 15A, TO-3PF

January 2008 Rev 7 1/11

BU941ZP

BU941ZPFI

High voltage ignition coil driver NPN power Darlington transistors

Features

■ Very rugged bipolar technology

■ Built in clamping Zener

■ High operating junction temperature

■ Fully insulated package (U.L. compliant) for

easy mounting

Applications

■ High ruggedness electronic ignitions

Description

The devices are bipolar Darlington transistors

manufactured using Multi-Epitaxial Planar

technology. They have been properly designed to

be used in Automotive environment as electronic

ignition power actuators.

Figure 1. Internal schematic diagram

TO-247 TO-3PF

Table 1. Device summary

Order code Marking Packages Packaging

BU941ZP BU941ZP TO-247 Tube

BU941ZPFI BU941ZPFI TO-3PF Tube

www.st.com

Summary of content (11 pages)

PAGE 1
BU941ZP BU941ZPFI High voltage ignition coil driver NPN power Darlington transistors Features ■ Very rugged bipolar technology ■ Built in clamping Zener ■ High operating junction temperature ■ Fully insulated package (U.L. compliant) for easy mounting 3 Applications ■ 2 1 High ruggedness electronic ignitions Description TO-247 Figure 1. TO-3PF Internal schematic diagram The devices are bipolar Darlington transistors manufactured using Multi-Epitaxial Planar technology.
PAGE 2
Absolute maximum ratings 1 BU941ZP BU941ZPFI Absolute maximum ratings Table 2.
PAGE 3
BU941ZP BU941ZPFI 2 Electrical characteristics Electrical characteristics (Tcase = 25°C; unless otherwise specified) Table 4.
PAGE 4
Electrical characteristics 2.1 4/11 BU941ZP BU941ZPFI Electrical characteristic (curves) Figure 2. Safe operating area Figure 3. Derating curve Figure 4. DC current gain Figure 5. DC current gain Figure 6. Collector-emitter saturation voltage Figure 7.
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BU941ZP BU941ZPFI Figure 8. Electrical characteristics Base-emitter saturation voltage Figure 9. Base-emitter saturation voltage Figure 10. Collector-emitter saturation voltage 2.2 Test circuit Figure 11.
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Electrical characteristics Figure 12. Functional test waveforms Figure 13.
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BU941ZP BU941ZPFI 3 Package mechanical data Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark.
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Package mechanical data BU941ZP BU941ZPFI TO-247 Mechanical data mm. Dim. A Min. 4.85 A1 2.20 2.60 b 1.0 1.40 b1 2.0 2.40 b2 3.0 3.40 c 0.40 0.80 D 19.85 20.15 E 15.45 15.75 e Max. 5.15 5.45 L 14.20 14.80 L1 3.70 4.30 L2 18.50 øP 3.55 øR 4.50 S 8/11 Typ 3.65 5.50 5.
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BU941ZP BU941ZPFI Package mechanical data TO-3PF mechanical data DIM. A C D D1 E F F2 G G1 H L L2 L3 L4 L5 L6 L7 N R Dia min. 5.30 2.80 3.10 1.80 0.80 0.65 1.80 10.30 mm. typ max. 5.70 3.20 3.50 2.20 1.10 0.95 2.20 11.50 5.45 15.30 9.80 22.80 26.30 43.20 4.30 24.30 14.60 1.80 3.80 3.40 10 15.70 10.20 23.20 26.70 44.40 4.70 24.70 15 2.20 4.20 3.
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Revision history BU941ZP BU941ZPFI 4 Revision history Table 5. 10/11 Document revision history Date Revision 03-Feb-2005 6 22-Jan-2008 7 Changes Package change from TO-218 to TO-247 and from ISOWATT218 to TO-3PF.
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BU941ZP BU941ZPFI Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.