Datasheet

ManualsBrandsST ManualsDiodesHigh Speed Interface ESD Protection Diode, Uni-Directional, SOT-666

May 2007 Rev 3 1/11

DSILC6-4xx

ESD Protection for high speed interface

Main applications

Where transient over-voltage protection in ESD

sensitive equipment is required, such as:

■ Computers

■ Printers

■ Communication systems

■ Cell phone handsets and accessories

■ Video equipment

Description

The DSILC6-4xx is a monolithic application

specific discrete dedicated to ESD protection of

high speed interfaces, such as USB 2.0, Ethernet,

display and camera serial interfaces (LVDS).

The device is ideal for applications where both

reduced printed circuit board space and power

absorption capability are required.

Features

Diode array topology

■ 4 line protection

■ 5 V V

protection

■ Very low capacitance: 1 pF typ.

■ Lead-free pacakge

■ RoHS compliant

Benefits

■ Very low capacitance between lines to GND for

optimized data integrity

■ Low PCB space consumption: 2.9 mm² max for

SOT-666 and 1.5 mm² max for Flip-Chip

■ Cut-off frequency > 2 GHz

■ High reliability offered by monolithic integration

■ MDDI, SMIA, MIPI specification compliant

Functional diagram

Order Code

Complies with the following standards:

Part Number Marking

DSILC6-4P6 G

DSILC6-4F2 EI

IEC 61000-4-2 level 4:

8 kV (contact discharge)

15 kV (air discharge)

MIL STD 883G-Method 3015-7: class 3B

I/O2

I/O3

I/O4

I/O1

VCC

GND

Flip-Chip

DSILC6-4F2

SOT-666

DSILC6-4P6

I/O3

I/O4

VCC

GND

I/O2

I/O1

I/O4

I/O3

GND

VCC

I/O1

I/O2

I/O1

I/O4

GND

VCC

I/O2

I/O3

Flip-Chip

Top-side view

Flip-Chip

Top-side view

SOT-666

Top-side view

www.st.com

Summary of content (11 pages)

PAGE 1
DSILC6-4xx ESD Protection for high speed interface Main applications I/O3 VCC Where transient over-voltage protection in ESD sensitive equipment is required, such as: ■ ■ ■ ■ ■ I/O4 I/O2 GND I/O1 Computers Printers Communication systems Cell phone handsets and accessories Video equipment SOT-666 DSILC6-4P6 Flip-Chip DSILC6-4F2 Functional diagram Description I/O4 I/O3 VCC The DSILC6-4xx is a monolithic application specific discrete dedicated to ESD protection of high speed interfaces, such as US
PAGE 2
Characteristics DSILC6-4xx 1 Characteristics Table 1. Absolute ratings Symbol Parameter Value Unit 8 15 kV IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge VPP Peak pulse voltage IPP Peak pulse current PPP Peak pulse power Tstg Storage temperature range SOT-666 5 Flip-Chip 7 A I/O to GND Pulse waveform = 8/20 µs SOT-666 90 Flip-Chip 120 W -55 to +150 °C Tj Maximum junction temperature 125 °C TL Lead solder temperature (10 seconds duration) 260 °C Table 2.
PAGE 3
DSILC6-4xx Figure 1. Characteristics Figure 2. Relative variation of leakage current versus junction temperature - SOT-666 (typical values) IRM[Tj] / IRM[Tj=25°C] 100 100 Relative variation of leakage current versus junction temperature Flip-Chip (typical values) IRM[Tj] / IRM[Tj=25°C] VR = 5V VR = 5V 10 10 Tj(°C) Tj(°C) 1 1 50 100 125 25 50 Remaining voltage after Figure 4. DSILC6-4P6 during ESD 15 kV positive surge (air discharge) 10 V/div Figure 3.
PAGE 4
Characteristics Figure 7. DSILC6-4xx Frequency responses of all lines DSILC6-4P6 Figure 8. S21(dB) 0.00 0.00 Frequency response of all lines DSILC6-4F2 S21 (dB) - 5.00 - 5.00 - 10.00 - 10.00 - 15.00 - 15.00 - 20.00 F(Hz) F (Hz) - 25.00 - 20.00 100.0k 1.0M 10.0M 100.0M Line 1 Line 3 Figure 9. 1.0M 1.0G 3.0M 10.0M Crosstalk results for lines 1/2 and 1/3 DSILC6-4P6 S21(dB) 0.00 - 20.00 - 20.00 - 40.00 - 40.00 - 60.00 - 60.00 - 80.00 - 80.00 - 100.00 - 100.00 1.0G 3.
PAGE 5
DSILC6-4xx Application examples 2 Application examples 2.1 MDDI Lower Clamshell Hinge Upper Clamshell Analog Earpiece Audio Power Power DSILC6-4xx MDDI Data (Host) Data+ DataStrobe+ Strobe- MDDI Strobe (Host) Base band IC GND GND 2.
PAGE 6
Application examples 2.3 DSILC6-4xx Ethernet 1 Gb +5V SMP75-8 BI_DA+ BI_DA- SMP75-8 BI_DB+ BI_DBDSILC6-4xx +5V DATA TRANSCEIVER DSILC6-4xx SMP75-8 BI_DC+ BI_DC- SMP75-8 BI_DD+ BI_DD- 2.4 USB 2.0 + 3.3V DEVICEUPSTREAM RPU TRANSCEIVER SW2 + 5V SW1 VBUS TX LS/FS + TX LS/FS - D+ DRS USBLC6-2SC6 GND RS RS RS RPD + 3.
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DSILC6-4xx 3 Ordering information scheme Ordering information scheme DSI LC 6 - 4 xx Product Designation Low capacitance Breakdown Voltage 6 = 6 Volts Number of lines protected 4 = 4 lines Packages P6 = SOT-666 F2 = Flip-Chip 7/11
PAGE 8
Package information 4 DSILC6-4xx Package information ● Epoxy meets UL94, V0 Table 3. SOT-666 Dimensions Dimensions b1 Ref. Millimeters Inches L1 Min. L3 Typ. Max. Min. Typ. Max. A 0.45 0.60 0.018 0.024 A3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.007 0.013 b1 0.19 D 1.50 1.70 0.059 0.067 E 1.50 1.70 0.059 0.067 E1 1.10 1.30 0.043 0.051 b D E1 0.27 0.34 0.007 0.011 0.013 A L2 E A3 e 0.50 0.020 L1 0.19 0.007 L2 0.10 0.30 0.004 0.012 e L3 Figure 11.
PAGE 9
DSILC6-4xx Package information Figure 13. Flip-Chip Dimensions 650 µm ± 65 1.57 mm ± 50µm 500 µm ± 50 500 µm ± 50 315 µm ± 50 1.1 mm ± 50 µm Figure 14. Flip-Chip footprint Figure 15. Flip-Chip marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) Copper pad Diameter : 220µm recommended Solder stencil opening : 330µm recommended E x x z y ww Solder mask opening recommendation : 300µm recommended Figure 16.
PAGE 10
Ordering information 5 6 Ordering information Ordering code Marking Package Weight Base qty Delivery mode DSILC6-4P6 G SOT-666 2.9 mg 3000 Tape and reel DSILC6-4F2 EI Flip-Chip 2.22 mg 5000 Tape and reel Revision history Date Revision 10-Aug-2006 1 Initial release. 04-Jan-2007 2 Added Flip-Chip package. Added applications examples for SMIA, Ethernet 1 Gb, and USB. Updated Tj max to 150. Added VRM line in Table 2. Modified MDDI example figure.
PAGE 11
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