Datasheet

ManualsBrandsST ManualsFiltersCommon Mode Filter with ESD Protection, 200mA, 2.5Ohm, QFN

March 2017

DocID17815 Rev 3

1/13

This is information on a product in full production.

www.st.com

ECMF02-2AMX6

Common mode filter with ESD protection for USB 2.0 and

MIPI D-PHY/MDDI interface

Datasheet - production data

Features

 High common mode attenuation:

 -34 dB at 900 MHz

 -20 dB between 800 MHz and 2.2 GHz

 Large bandwidth: 1.7 GHz

 Very low PCB space consumption

 Thin package: 0.55 mm max.

 RoHS package

 High reduction of parasitic elements through

integration

Complies with the following standards

 IEC 61000-4-2 (exceeds level 4)

 ±15 kV (air discharge)

 ±8 kV (contact discharge)

Applications

 Mobile phones

 Notebook, laptop

 Portable devices

 PND

Description

The device is a highly integrated common mode

filter designed to suppress EMI/RFI common

mode noise on high speed differential serial

buses like MIPI D-PHY, MDDI or USB 2.0.

Also it can protect and filter one differential lane.

Figure 1: Pin configuration

QFN-6L

D+ D+

GND NC

D-

ESD

D-

Summary of content (13 pages)

PAGE 1
ECMF02-2AMX6 Common mode filter with ESD protection for USB 2.0 and MIPI D-PHY/MDDI interface Datasheet - production data Applications     Mobile phones Notebook, laptop Portable devices PND Description The device is a highly integrated common mode filter designed to suppress EMI/RFI common mode noise on high speed differential serial buses like MIPI D-PHY, MDDI or USB 2.0. QFN-6L Also it can protect and filter one differential lane.
PAGE 2
Characteristics 1 ECMF02-2AMX6 Characteristics Table 1: Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit 8 20 kV 200 mA IEC 61000-4-2: Contact discharge Air discharge VPP Peak pulse voltage IDC Maximum DC current Tj Maximum junction temperature range -55 to +125 Tstg Storage temperature range -55 to +150 TL Maximum temperature for soldering during 10 s °C 260 Figure 2: Electrical characteristics (definitions) Table 2: Electrical characteristics (Tamb = 25 °C) Sy
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ECMF02-2AMX6 1.1 Characteristics Characteristics (curves) Figure 3: Differential insertion losses (Z0 diff = 100 Ω) 0 -0.2 -0.4 -0.6 -0.8 -1 -1.2 -1.4 -1.6 -1.8 -2 -2.2 -2.4 -2.6 -2.8 -3 SDD21 (dB) 0 - 0.2 - 0.4 - 0.6 - 0.8 -1 - 1.2 - 1.4 - 1.6 - 1.8 -2 - 2.2 - 2.4 - 2.6 - 2.
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Characteristics ECMF02-2AMX6 Figure 9: ESD response to IEC 61000-4-2 (+8 kV contact discharge) 20 V/Div Figure 10: ESD response to IEC 61000-4-2 (-8 kV contact discharge) 20 V/Div 20 ns/Div 82.3 V PIN 6 20 ns/Div PIN 6 C2 C2 -71.1 V 112 V PIN 5 PIN 5 C3 C3 -115 V 50 V/Div Figure 11: Low power pulse response 500 mV/div Pulse: 50 ns, t r = t f = 5 ns 20 ns/Div 50 V/Div 20 ns/Div Figure 12: USB 2.
PAGE 5
ECMF02-2AMX6 2 Application schematics Application schematics Figure 14: MIPI D-PHY Figure 15: USB 2.
PAGE 6
Package information 3 ECMF02-2AMX6 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK ® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 3.1 QFN-6L package information Figure 16: QFN-6L package outline Table 3: QFN-6L package mechanical data Dimensions Ref. 6/13 Millimeters Inches Min. Typ.
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ECMF02-2AMX6 Package information Figure 17: Footprint recommendations, dimensions in mm (inches) Figure 18: Marking layout pin 1 XX YQ XX : Marking Y : Year Q : Quarter Figure 20: Tape and reel orientation Figure 19: Package orientation in reel Pin 1 located according to EIA-481 Note: Pocket dimensions are not on scale Pocket shape may vary depending on package Figure 21: Reel dimensions in mm Figure 22: Inner box dimension definition in mm DocID17815 Rev 3 7/13
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Package information ECMF02-2AMX6 Figure 23: Tape dimension definitions Table 4: Tape mechanical data Dimensions Ref. 8/13 Millimeters Min. Typ. Max. P0 3.9 4.0 4.1 P1 3.9 4.0 4.1 P2 1.95 2 2.05 Ø D0 1.5 1.55 1.6 Ø D1 1 F 3.4 3.5 3.6 K0 0.65 0.7 0.75 W 7.7 8 8.
PAGE 9
ECMF02-2AMX6 Recommendation on PCB assembly 4 Recommendation on PCB assembly 4.1 Stencil opening design 1. 2. General recommendation on stencil opening design a. Stencil opening dimensions: L (Length), W (Width), T (Thickness). General design rule a. Stencil thickness (T) = 75 ~ 125 μm 𝑊 b. Aspect ratio = ≥ 1.5 𝑇 c. 3. Aspect area = 𝐿×𝑊 2𝑇(𝐿+𝑊) ≥ 0.66 Reference design a. Stencil opening thickness: 100 μm b. Stencil opening for leads: Opening to footprint ratio is 90%.
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Recommendation on PCB assembly 4.2 Solder paste 1. 2. 3. 4. 4.3 3. 4. 5. 6. Manual positioning is not recommended. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering Standard tolerance of ±0.05 mm is recommended. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short.
PAGE 11
ECMF02-2AMX6 4.6 Recommendation on PCB assembly Reflow profile Figure 27: ST ECOPACK® recommended soldering reflow profile for PCB mounting Minimize air convection currents in the reflow oven to avoid component movement. Maximum soldering profile corresponds to the latest IPC/JEDEC J-STD-020.
PAGE 12
Ordering information 5 ECMF02-2AMX6 Ordering information Figure 28: Ordering information scheme ECMF 02 – 2 A xxx Function ESD common mode filter Number of lines 02 = 2 lines Number of ESD protected lines 2 = 2 ESD protected lines Version Package MX6 = QFN-6L Table 5: Ordering information Order code Marking Package Weight Base qty. Delivery mode ECMF02-2AMX6 KD(1) QFN-6L 3.
PAGE 13
ECMF02-2AMX6 IMPORTANT NOTICE – PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.