Datasheet

MOUNTING INSTRUCTIONS
The R
th j-amb
of the L293B and the L293E can be re-
duced by soldering the GND pins to a suitable cop-
per area of the printed circuit boardas shownin fig-
ure 12 or to an external heatsink (figure 13).
During soldering the pins temperaturemust not ex-
ceed 260
o
C and the soldering time must not be
longerthan 12 seconds.
The external heatsinkor printed circuit copper area
must be connectedto electrical ground.
Figure12:Example of P.C. Board Copper
Area which is Used as Heatsink
Figure 13 :External Heatsink Mounting Ex-
ample (Rth = 30
o
C/W)
L293B - L293E
9/12