Datasheet

Package information LIS3LV02DL
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9 Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK
®
is an ST trademark.
ECOPACK
®
specifications are available at: www.st.com.
Figure 28. LGA-16 mechanical data and package dimensions
OUTLINE AND
MECHANICAL DATA
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A1 0.92 1 0.0394
A2 0.7 0.0276
A3 0.180 0.220 0.260 0.0071 0.0087 0.0102
D1 4.250 4.400 4.550 0.1673 0.1732 0.1791
E1 7.350 7.500 7.650 0.2894 0.2953 0.3012
e 1.0 0.0394
d 0.3 0.0118
L1 5.000 0.1969
N 2.5 0.0984
N1 1.2 0.0472
P1 0.965 0.975 0.985 0.0380 0.0384 0.0388
P2 0.64 0.65 0.66 0.0252 0.0256 0.0260
T1 0.75 0.8 0.85 0.0295 0.0315 0.0335
T2 0.45 0.5 0.55 0.0177 0.0197 0.0217
R 1.200 1.600 0.0472 0.0630
h 0.150 0.0059
k 0.050 0.0020
i 0.100 0.0039
s 0.100 0.0039
LGA16 (4.4x7.5x1mm)
Land Grid Array Package
7863679 B
E1
P2
L1
T2
D1
P1
BACi
A3
R
A2
A1
12 4 56
7
8
16
15
91011121314
3
N1
e
T1
s
e
N
d
Detail A
Detail A
Metal Pad
seating plane
Solder mask
opening
i
E
C
D
D
A
E
B
i
BACh
Dk
BACh
BACi
Ek
k
(4 x)