Datasheet

Initial delivery state M24C16, M24C08, M24C04, M24C02, M24C01
18/39 Doc ID 5067 Rev 16
4 Initial delivery state
The device is delivered with all bits in the memory array set to 1 (each byte contains FFh).
5 Maximum rating
Stressing the device outside the ratings listed in Tabl e 5 may cause permanent damage to
the device. These are stress ratings only, and operation of the device at these, or any other
conditions outside those indicated in the operating sections of this specification, is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability. Refer also to the STMicroelectronics SURE program and other relevant
quality documents.
Table 5. Absolute maximum ratings
Symbol Parameter Min. Max. Unit
T
A
Ambient operating temperature –40 130 °C
T
STG
Storage temperature –65 150 °C
T
LEAD
Lead temperature during soldering see note
(1)
1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK
®
7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS)
2002/95/EU.
°C
PDIP-specific lead temperature during soldering 260
(2)
2. T
LEAD
max must not be applied for more than 10 s.
°C
I
OL
DC output current (SDA = 0) - 5 mA
V
IO
Input or output range –0.50 6.5 V
V
CC
Supply voltage –0.50 6.5 V
V
ESD
Electrostatic discharge voltage (human body model)
(3)
3. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114, C1 = 100 pF, R1 = 1500 Ω, R2 = 500 Ω).
–4000 4000 V