Datasheet

M24C16, M24C08, M24C04, M24C02, M24C01 Package mechanical data

Doc ID 5067 Rev 16 29/39

Figure 15. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, outline

1. Drawing is not to scale.

2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to V

. It must not be

allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering

process.

3. The circle in the top view of the package indicates the position of pin 1.

Table 21. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, data

Symbol

millimeters inches

(1)

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Typ Min Max Typ Min Max

A 0.55 0.45 0.6 0.0217 0.0177 0.0236

A1 0.02 0 0.05 0.0008 0 0.002

b 0.25 0.2 0.3 0.0098 0.0079 0.0118

D 2 1.9 2.1 0.0787 0.0748 0.0827

D2 (rev MB) 1.6 1.5 1.7 0.063 0.0591 0.0669

D2 (rev MC) 1.45 1.7 0.0571 0.0669

E 3 2.9 3.1 0.1181 0.1142 0.122

E2 (rev MB) 0.2 0.1 0.3 0.0079 0.0039 0.0118

E2 (rev MC) 1.25 1.6 0.0492 0.063

e 0.5 - - 0.0197 - -

K - 0.3 - - 0.0118 -

L - 0.3 0.5 - 0.0118 0.0197

L1 - - 0.15 - 0.0059

L3 0.3 - - 0.0118 -

ddd

(2)

2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

0.05 - - 0.002 - -

ZW_MEc

ddd

Pin 1

REV MB

REV MC