Datasheet

ManualsBrandsST ManualsEEPROMEEPROM 128 x 16 Bit/256 x 8 Bit SO-8

1/31August 2004

M93C86, M93C76, M93C66

M93C56, M93C46

16Kbit, 8Kbit, 4Kbit, 2Kbit and 1Kbit (8-bit or 16-bit wide)

MICROWIRE® Serial Access EEPROM

FEATURES SUMMARY

■ Industry Standard MICROWIRE Bus

■ Single Supply Voltage:

– 4.5 to 5.5V for M93Cx6

– 2.5 to 5.5V for M93Cx6-W

– 1.8 to 5.5V for M93Cx6-R

■ Dual Organization: by Word (x16) or Byte (x8)

■ Programming Instructions that work on: Byte,

Word or Entire Memory

■ Self-timed Programming Cycle with Auto-

Erase

■ Ready/Busy Signal During Programming

■ Speed:

– 1MHz Clock Rate, 10ms Write Time

(Current product, identified by process

identification letter F or M)

– 2MHz Clock Rate, 5ms Write Time (New

Product, identified by process

identification letter W or G or S)

■ Sequential Read Operation

■ Enhanced ESD/Latch-Up Behaviour

■ More than 1 Million Erase/Write Cycles

■ More than 40 Year Data Retention

Table 1. Product List

Figure 1. Packages

Reference

Part

Number

Reference

Part

Number

M93C86

M93C56

M93C86-W M93C56-W

M93C86-R M93C56-R

M93C76

M93C46

M93C76-W M93C46-W

M93C76-R M93C46-R

M93C66

M93C66-W

M93C66-R

PDIP8 (BN)

SO8 (MN)

150 mil width

TSSOP8 (DW)

169 mil width

TSSOP8 (DS)

3x3mm² body size (MSOP)

UFDFPN8 (MB)

2x3mm² (MLP)

Summary of content (31 pages)

PAGE 1
M93C86, M93C76, M93C66 M93C56, M93C46 16Kbit, 8Kbit, 4Kbit, 2Kbit and 1Kbit (8-bit or 16-bit wide) MICROWIRE® Serial Access EEPROM FEATURES SUMMARY ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Industry Standard MICROWIRE Bus Single Supply Voltage: – 4.5 to 5.5V for M93Cx6 – 2.5 to 5.5V for M93Cx6-W – 1.8 to 5.
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M93C86, M93C76, M93C66, M93C56, M93C46 TABLE OF CONTENTS FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 1. Figure 1. Figure 2. Table 2. Table 3. Table 4. Figure 3. Product List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PAGE 3
M93C86, M93C76, M93C66, M93C56, M93C46 Table 14. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 15. DC Characteristics (M93Cx6, Device Grade 6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 16. DC Characteristics (M93Cx6, Device Grade 7 or 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 17. DC Characteristics (M93Cx6-W, Device Grade 6) . . . . . . . . . . . . . . . . . .
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M93C86, M93C76, M93C66, M93C56, M93C46 SUMMARY DESCRIPTION Table 3. Memory Size versus Organization These electrically erasable programmable memory (EEPROM) devices are accessed through a Serial Data Input (D) and Serial Data Output (Q) using the MICROWIRE bus protocol. Figure 2.
PAGE 5
M93C86, M93C76, M93C66, M93C56, M93C46 An internal Power-on Data Protection mechanism in the M93Cx6 inhibits the device when the supply is too low. Figure 3. DIP, SO, TSSOP and MLP Connections (Top View) M93Cx6 S C D Q 1 2 3 4 8 7 6 5 VCC DU ORG VSS AI01929B Note: 1. See PACKAGE MECHANICAL section for package dimensions, and how to identify pin-1. 2. DU = Don’t Use. The DU (Don’t Use) pin does not contribute to the normal operation of the device.
PAGE 6
M93C86, M93C76, M93C66, M93C56, M93C46 INSTRUCTIONS The instruction set of the M93Cx6 devices contains seven instructions, as summarized in Table 5. to Table 7.. Each instruction consists of the following parts, as shown in Figure 4.: ■ Each instruction is preceded by a rising edge on Chip Select Input (S) with Serial Clock (C) being held Low. ■ A start bit, which is the first ‘1’ read on Serial Data Input (D) during the rising edge of Serial Clock (C).
PAGE 7
M93C86, M93C76, M93C66, M93C56, M93C46 Table 6.
PAGE 8
M93C86, M93C76, M93C66, M93C56, M93C46 Read The Read Data from Memory (READ) instruction outputs data on Serial Data Output (Q). When the instruction is received, the op-code and address are decoded, and the data from the memory is transferred to an output shift register. A dummy 0 bit is output first, followed by the 8-bit byte or 16bit word, with the most significant bit first. Output data changes are triggered by the rising edge of Serial Clock (C).
PAGE 9
M93C86, M93C76, M93C66, M93C56, M93C46 Erase The Erase Byte or Word (ERASE) instruction sets the bits of the addressed memory byte (or word) to 1. Once the address has been correctly decoded, the falling edge of the Chip Select Input (S) starts the self-timed Erase cycle. The completion of the cycle can be detected by monitoring the Ready/ Busy line, as described in the READY/BUSY STATUS section. Write For the Write Data to Memory (WRITE) instruction, 8 or 16 data bits follow the op-code and address bits.
PAGE 10
M93C86, M93C76, M93C66, M93C56, M93C46 Erase All The Erase All Memory (ERAL) instruction erases the whole memory (all memory bits are set to 1). The format of the instruction requires that a dummy address be provided. The Erase cycle is conducted in the same way as the Erase instruction (ERASE). The completion of the cycle can be detected by monitoring the Ready/Busy line, as described in the READY/BUSY STATUS section.
PAGE 11
M93C86, M93C76, M93C66, M93C56, M93C46 READY/BUSY STATUS CLOCK PULSE COUNTER While the Write or Erase cycle is underway, for a WRITE, ERASE, WRAL or ERAL instruction, the Busy signal (Q=0) is returned whenever Chip Select Input (S) is driven High. (Please note, though, that there is an initial delay, of tSLSH, before this status information becomes available). In this state, the M93Cx6 ignores any data on the bus.
PAGE 12
M93C86, M93C76, M93C66, M93C56, M93C46 MAXIMUM RATING Stressing the device above the rating listed in the Absolute Maximum Ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not im- plied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
PAGE 13
M93C86, M93C76, M93C66, M93C56, M93C46 DC AND AC PARAMETERS This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the Measure- ment Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 9.
PAGE 14
M93C86, M93C76, M93C66, M93C56, M93C46 Table 12. AC Measurement Conditions (M93Cx6) Symbol CL Parameter Min. Max. Load Capacitance Unit 100 Input Rise and Fall Times pF 50 Input Pulse Voltages ns 0.4 V to 2.4 V V Input Timing Reference Voltages 1.0 V and 2.0 V V Output Timing Reference Voltages 0.8 V and 2.0 V V Note: 1. Output Hi-Z is defined as the point where data out is no longer driven. Table 13. AC Measurement Conditions (M93Cx6-W and M93Cx6-R) Symbol CL Parameter Min. Max.
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M93C86, M93C76, M93C66, M93C56, M93C46 Table 15. DC Characteristics (M93Cx6, Device Grade 6) Symbol Parameter ILI Input Leakage Current ILO Output Leakage Current Test Condition Min. Max. Unit 0V ≤ VIN ≤ VCC ±2.5 µA 0V ≤ VOUT ≤ VCC, Q in Hi-Z ±2.5 µA 1.
PAGE 16
M93C86, M93C76, M93C66, M93C56, M93C46 Table 17. DC Characteristics (M93Cx6-W, Device Grade 6) Symbol Parameter ILI Input Leakage Current ILO Output Leakage Current Test Condition Min. Max. Unit 0V ≤ VIN ≤ VCC ±2.5 µA 0V ≤ VOUT ≤ VCC, Q in Hi-Z ±2.5 µA 1.5 mA 1 mA 2 mA 1 mA 10 µA 5 µA VCC = 5V, S = VIH, f = 1 MHz, Current Product 1 VCC = 2.5V, S = VIH, f = 1 MHz, Current ICC Supply Current (CMOS Inputs) Product 1 VCC = 5V, S = VIH, f = 2 MHz, New Product 2 VCC = 2.
PAGE 17
M93C86, M93C76, M93C66, M93C56, M93C46 Table 18. DC Characteristics (M93Cx6-W, Device Grade 7 or 3) Symbol Parameter ILI Input Leakage Current ILO Output Leakage Current ICC ICC1 Supply Current (CMOS Inputs) Supply Current (Stand-by) Max. 1 Unit 0V ≤ VIN ≤ VCC ±2.5 µA 0V ≤ VOUT ≤ VCC, Q in Hi-Z ±2.5 µA VCC = 5V, S = VIH, f = 2 MHz 2 mA VCC = 2.5V, S = VIH, f = 2 MHz 1 mA VCC = 2.5V, S = VSS, C = VSS, ORG = VSS or VCC 5 µA Test Condition Min.
PAGE 18
M93C86, M93C76, M93C66, M93C56, M93C46 Table 20. AC Characteristics (M93Cx6, Device Grade 6, 7 or 3) Test conditions specified in Table 12. and Table 9. Symbol Alt. fC fSK tSLCH tSHCH tCSS Min.3 Max.3 Min.4 Max.4 Unit Clock Frequency D.C. 1 D.C.
PAGE 19
M93C86, M93C76, M93C66, M93C56, M93C46 Table 21. AC Characteristics (M93Cx6-W, Device Grade 6) Test conditions specified in Table 13. and Table 10. Symbol Alt. fC fSK tSLCH Min.3 Max.3 Min.4 Max.4 Unit Clock Frequency D.C. 1 D.C.
PAGE 20
M93C86, M93C76, M93C66, M93C56, M93C46 Table 22. AC Characteristics (M93Cx6-W, Device Grade 7 or 3) Test conditions specified in Table 13. and Table 10. Symbol Alt. fC fSK tSLCH Parameter Clock Frequency Min.3 Max.3 Unit D.C.
PAGE 21
M93C86, M93C76, M93C66, M93C56, M93C46 Table 23. AC Characteristics (M93Cx6-R) Test conditions specified in Table 13. and Table 11. Symbol Alt. fC fSK tSLCH Min.3 Max.3 Unit Clock Frequency D.C.
PAGE 22
M93C86, M93C76, M93C66, M93C56, M93C46 Figure 9. Synchronous Timing (Start and Op-Code Input) tCLSH tCHCL C tSHCH tCLCH S tDVCH D START tCHDX OP CODE START OP CODE OP CODE INPUT AI01428 Figure 10. Synchronous Timing (Read or Write) C tCLSL S tDVCH tCHDX A0 An D tSLSH tCHQV tSLQZ tCHQL Hi-Z Q15/Q7 Q ADDRESS INPUT Q0 DATA OUTPUT AI00820C Figure 11.
PAGE 23
M93C86, M93C76, M93C66, M93C56, M93C46 PACKAGE MECHANICAL Figure 12. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline E b2 A2 A1 b A L c e eA eB D 8 E1 1 PDIP-B Note: Drawing is not to scale. Table 24. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data mm inches Symb. Typ. Min. A Max. Typ. Min. 5.33 A1 Max. 0.210 0.38 0.015 A2 3.30 2.92 4.95 0.130 0.115 0.195 b 0.46 0.36 0.56 0.018 0.014 0.022 b2 1.52 1.14 1.78 0.060 0.045 0.
PAGE 24
M93C86, M93C76, M93C66, M93C56, M93C46 Figure 13. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline h x 45˚ A C B CP e D N E H 1 A1 α L SO-a Note: Drawing is not to scale. Table 25. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data mm inches Symb. Typ. Min. Max. A 1.35 A1 Min. Max. 1.75 0.053 0.069 0.10 0.25 0.004 0.010 B 0.33 0.51 0.013 0.020 C 0.19 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 E 3.
PAGE 25
M93C86, M93C76, M93C66, M93C56, M93C46 Figure 14. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Outline e D b L1 L3 E E2 L A D2 ddd A1 UFDFPN-01 Note: 1. Drawing is not to scale. 2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering process. Table 26.
PAGE 26
M93C86, M93C76, M93C66, M93C56, M93C46 Figure 15. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Package Outline D 8 5 c E1 1 E 4 α L A1 A A2 L1 CP b e TSSOP8BM Note: Drawing is not to scale. Table 27. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Mechanical Data mm inches Symbol Typ. Min. A 0.050 0.150 0.750 0.950 b 0.250 c A2 Typ. Min. 1.100 A1 0.850 Max. 0.0433 0.0020 0.0059 0.0295 0.0374 0.400 0.0098 0.0157 0.130 0.
PAGE 27
M93C86, M93C76, M93C66, M93C56, M93C46 Figure 16. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline D 8 5 c E1 1 E 4 α L A1 A A2 L1 CP b e TSSOP8AM Note: Drawing is not to scale. Table 28. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data mm inches Symbol Typ. Min. A Max. Min. 1.200 A1 0.050 0.150 0.800 1.050 b 0.190 c 0.090 A2 Typ. 1.000 CP Max. 0.0472 0.0020 0.0059 0.0315 0.0413 0.300 0.0075 0.0118 0.200 0.0035 0.0079 0.0394 0.
PAGE 28
M93C86, M93C76, M93C66, M93C56, M93C46 PART NUMBERING Table 29. Ordering Information Scheme Example: M93C86 – W MN 6 T P Device Type M93 = MICROWIRE serial access EEPROM Device Function 86 = 16 Kbit (2048 x 8) 76 = 8 Kbit (1024 x 8) 66 = 4 Kbit (512 x 8) 56 = 2 Kbit (256 x 8) 46 = 1 Kbit (128 x 8) Operating Voltage blank = VCC = 4.5 to 5.5V W = VCC = 2.5 to 5.5V R = VCC = 1.8 to 5.
PAGE 29
M93C86, M93C76, M93C66, M93C56, M93C46 Devices are shipped from the factory with the memory content set at all 1s (FFFFh for x16, FFh for x8). For a list of available options (speed, package, etc.) or for further information on any aspect of this device, please contact your nearest ST Sales Office. Table 30.
PAGE 30
M93C86, M93C76, M93C66, M93C56, M93C46 REVISION HISTORY Table 31. Document Revision History Date Rev. Description of Revision 04-Feb-2003 2.0 Document reformatted, and reworded, using the new template. Temperature range 1 removed. TSSOP8 (3x3mm) package added. New products, identified by the process letter W, added, with fc(max) increased to 1MHz for -R voltage range, and to 2MHz for all other ranges (and corresponding parameters adjusted) 26-Mar-2003 2.
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M93C86, M93C76, M93C66, M93C56, M93C46 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice.