M93C86-x M93C76-x M93C66-x M93C56-x M93C46-x 16-Kbit, 8-Kbit, 4-Kbit, 2-Kbit and 1-Kbit (8-bit or 16-bit wide) MICROWIRE serial access EEPROM Datasheet - production data READY/BUSY signal during programming 2 MHz clock rate Sequential read operation Enhanced ESD/latch-up behavior More than 4 million write cycles PDIP8 (BN) More than 200-year data retention Packages – SO8, TSSOP8, UFDFPN8 packages: RoHS-compliant and Halogen-free (ECOPACK®) – PDIP8 package: RoHS-compliant (ECOPACK1®) SO8 (
Contents M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 Connecting to the serial bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 Operating features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1 Supply voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1.
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x 13 Contents Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
List of tables M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. 4/33 Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Memory size versus organization . . . . . . . . . . . . . . . . . . . . .
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8-pin package connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Description 1 M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Description The M93C46 (1 Kbit), M93C56 (2 Kbit), M93C66 (4 Kbit), M93C76 (8 Kbit) and M93C86 (16 Kbit) are Electrically Erasable PROgrammable Memory (EEPROM) devices accessed through the MICROWIRE bus protocol. The memory array can be configured either in bytes (x8b) or in words (x16b). The M93Cx6-W devices operate within a voltage supply range from 2.5 V to 5.5 V and the M93Cx6-R devices operate within a voltage supply range from 1.8 V to 5.
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Description Figure 2. 8-pin package connections (top view) M93Cx6 S C D Q 1 2 3 4 8 7 6 5 VCC DU ORG VSS AI01929B 1. See Section 11: Package mechanical data for package dimensions, and how to identify pin-1. 2. DU = Don’t Use. The DU (do not use) pin does not contribute to the normal operation of the device. It is reserved for use by STMicroelectronics during test sequences. The pin may be left unconnected or may be connected to VCC or VSS.
Connecting to the serial bus 2 M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Connecting to the serial bus Figure 3 shows an example of three memory devices connected to an MCU, on a serial bus. Only one device is selected at a time, so only one device drives the Serial Data output (Q) line at a time, the other devices are high impedance. The pull-down resistor R (represented in Figure 3) ensures that no device is selected if the bus master leaves the S line in the high impedance state.
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x 3 Operating features 3.1 Supply voltage (VCC) 3.1.1 Operating supply voltage (VCC) Operating features Prior to selecting the memory and issuing instructions to it, a valid and stable VCC voltage within the specified [VCC(min), VCC(max)] range must be applied. In order to secure a stable DC supply voltage, it is recommended to decouple the VCC line with a suitable capacitor (usually of the order of 10 nF to 100 nF) close to the VCC/VSS package pins.
Memory organization 4 M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Memory organization The M93Cx6 memory is organized either as bytes (x8) or as words (x16). If Organization Select (ORG) is left unconnected (or connected to VCC) the x16 organization is selected; when Organization Select (ORG) is connected to Ground (VSS) the x8 organization is selected.
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x 5 Instructions Instructions The instruction set of the M93Cx6 devices contains seven instructions, as summarized in Table 4 to Table 6. Each instruction consists of the following parts, as shown in Figure 5: READ, WRITE, WEN, WDS sequences: Each instruction is preceded by a rising edge on Chip Select Input (S) with Serial Clock (C) being held low.
Instructions M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Table 5.
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x 5.1 Instructions Read Data from Memory The Read Data from Memory (READ) instruction outputs data on Serial Data Output (Q). When the instruction is received, the op-code and address are decoded, and the data from the memory is transferred to an output shift register. A dummy 0 bit is output first, followed by the 8-bit byte or 16-bit word, with the most significant bit first. Output data changes are triggered by the rising edge of Serial Clock (C).
Instructions M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Figure 5. READ, WRITE, WEN, WDS sequences Read S D 1 1 0 An A0 Qn Q ADDR Q0 DATA OUT OP CODE Write S CHECK STATUS D 1 0 1 An A0 Dn D0 Q ADDR DATA IN BUSY READY OP CODE Write Enable S D Write Disable 1 0 0 1 1 Xn X0 S D OP CODE 1 0 0 0 0 Xn X0 OP CODE AI00878d 1. For the meanings of An, Xn, Qn and Dn, see Table 4, Table 5 and Table 6.
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x 5.2.3 Instructions Write All As with the Erase All Memory (ERAL) instruction, the format of the Write All Memory with same Data (WRAL) instruction requires that a dummy address be provided. As with the Write Data to Memory (WRITE) instruction, the format of the Write All Memory with same Data (WRAL) instruction requires that an 8-bit data byte, or 16-bit data word, be provided. This value is written to all the addresses of the memory device.
Instructions 5.2.4 M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Erase Byte or Word The Erase Byte or Word (ERASE) instruction sets the bits of the addressed memory byte (or word) to 1. Once the address has been correctly decoded, the falling edge of the Chip Select Input (S) starts the self-timed Erase cycle. The completion of the cycle can be detected by monitoring the READY/BUSY line, as described in Section 6: READY/BUSY status. Figure 7.
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x 6 READY/BUSY status READY/BUSY status While the Write or Erase cycle is underway, for a WRITE, ERASE, WRAL or ERAL instruction, the Busy signal (Q=0) is returned whenever Chip Select input (S) is driven high. (Please note, though, that there is an initial delay, of tSLSH, before this status information becomes available). In this state, the M93Cx6 ignores any data on the bus.
Clock pulse counter 8 M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Clock pulse counter In a noisy environment, the number of pulses received on Serial Clock (C) may be greater than the number delivered by the master (the microcontroller). This can lead to a misalignment of the instruction of one or more bits (as shown in Figure 8) and may lead to the writing of erroneous data at an erroneous address.
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x 9 Maximum ratings Maximum ratings Stressing the device outside the ratings listed in the Absolute maximum ratings table may cause permanent damage to the device. These are stress ratings only, and operation of the device at these, or any other conditions outside those indicated in the operating sections of this specification, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 7.
DC and AC parameters 10 M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x DC and AC parameters This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. Table 8. Operating conditions (M93Cx6-W) Symbol VCC TA Parameter Min. Max. Unit Supply voltage 2.5 5.5 V Ambient operating temperature –40 85 °C Min. Max. Unit Supply voltage 1.8 5.5 V Ambient operating temperature –40 85 °C Table 9.
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x DC and AC parameters Table 12. AC measurement conditions Symbol CL Parameter Min. Load capacitance Max. Unit 100 - pF - Input rise and fall times 50 ns - Input voltage levels 0.2 VCC to 0.8 VCC V - Input timing reference voltages 0.3 VCC to 0.7 VCC V - Output timing reference voltages 0.3 VCC to 0.7 VCC V Figure 9. AC testing input output waveforms M93CXX 0.8VCC 0.7VCC Input voltage levels 0.3VCC 0.
DC and AC parameters M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Table 14. DC characteristics (M93Cx6-W, device grade 6) Symbol ILI Input leakage current ILO Output leakage current ICC ICC1 1. Parameter Operating supply current Standby supply current Test condition (in addition to the conditions defined in Table 8 and Table 12) Min. Max. Unit 0V VIN VCC - ±2.5 µA 0V VOUT VCC, Q in Hi-Z - ±2.5 µA VCC = 5 V, S = VIH, f = 2 MHz, Q = open - 2 mA VCC = 2.
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x DC and AC parameters Table 16. AC characteristics (M93Cx6-W, M93Cx6-R(1), device grade 6) Test conditions specified in Table 8 and Table 12 Symbol Alt. fC fSK Min. Max. Unit D.C.
DC and AC parameters M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Table 17. AC characteristics (M93Cx6-R)(1) Test conditions specified in Table 9 and Table 12 Symbol Alt. fC fSK tSLCH Parameter Min. Max. Unit Clock frequency D.C.
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x DC and AC parameters Figure 10. Synchronous timing (Start and op-code input) tCLSH tCHCL C tSHCH tCLCH S tDVCH tCHDX OP CODE START D START OP CODE OP CODE INPUT ai01428 Figure 11. Synchronous timing (Read) C tCLSL S tDVCH D tCHDX tCHQV tSLSH A0 An tSLQZ tCHQL Hi-Z Q Q15/Q7 ADDRESS INPUT Q0 DATA OUTPUT AI00820C Figure 12.
Package mechanical data 11 M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark . Figure 13.
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Package mechanical data Figure 14. SO8 narrow – 8 lead plastic small outline, 150 mils body width, package outline h x 45° A2 A c ccc b e 0.25 mm GAUGE PLANE D k 8 E1 E 1 L A1 L1 SO-A 1. Drawing is not to scale. Table 19. SO8 narrow – 8 lead plastic small outline, 150 mils body width, package data inches(1) millimeters Symbol Typ Min Max Typ Min Max A - - 1.75 - - 0.0689 A1 - 0.1 0.25 - 0.0039 0.0098 A2 - 1.25 - - 0.
Package mechanical data M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Figure 15. UFDFPN8 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2 x 3 mm, outline D e MC b L1 L3 Pin 1 E E2 K L A D2 eee A1 ZW_MEeV2 1. Drawing is not to scale. 2. The central pad (area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering process. 3.
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Package mechanical data Figure 16. TSSOP8 – 8 lead thin shrink small outline, package outline D 5 8 c E1 E 4 1 a A1 A A2 L L1 CP e b TSSOP8AM 1. Drawing is not to scale. Table 21. TSSOP8 – 8-lead thin shrink small outline, package mechanical data inches(1) millimeters Symbol Typ Min Max Typ Min Max A - - 1.200 - - 0.0472 A1 - 0.050 0.150 - 0.0020 0.0059 A2 1.000 0.800 1.050 0.0394 0.0315 0.0413 b - 0.190 0.300 - 0.
Part numbering 12 M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Part numbering Table 22. Ordering information scheme Example: M93C86 – W MN 6 T P Device type M93 = MICROWIRE serial EEPROM Device function 86 = 16 Kbit (2048 x 8) 76 = 8 Kbit (1024 x 8) 66 = 4 Kbit (512 x 8) 56 = 2 Kbit (256 x 8) 46 = 1 Kbit (128 x 8) Operating voltage W = VCC = 2.5 to 5.5 V R = VCC = 1.8 to 5.
M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x 13 Revision history Revision history Table 23.
Revision history M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x Table 23. Document revision history (continued) Date 32/33 Revision Changes 26-Oct-2013 14 Updated: – Table 1: Device summary: added “M93C46-R” and “M93C86-R”, deleted M93Cxx part numbers. – Features: Single supply voltage, write cycles and data retention – Section 1: Description – Note (2) under Table 7: Absolute maximum ratings.
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