Datasheet

Package characteristics STM8L051F3
92/96 DS9178 Rev 4
9.4 Thermal characteristics
The maximum chip junction temperature (T
Jmax
) must never exceed the values given in
Table 15: General operating conditions on page 48.
The maximum chip-junction temperature, T
Jmax
, in degree Celsius, may be calculated using
the following equation:
T
Jmax
= T
Amax
+ (P
Dmax
x Θ
JA
)
Where:
• T
Amax
is the maximum ambient temperature in ° C
•Θ
JA
is the package junction-to-ambient thermal resistance in ° C/W
• P
Dmax
is the sum of P
INTmax
and P
I/Omax
(P
Dmax
= P
INTmax
+ P
I/Omax
)
• P
INTmax
is the product of I
DD
and V
DD
, expressed in Watts. This is the maximum chip
internal power.
• P
I/Omax
represents the maximum power dissipation on output pins
Where:
P
I/Omax
= Σ (V
OL
*I
OL
) + Σ((V
DD
-V
OH
)*I
OH
),
taking into account the actual V
OL
/I
OL
and V
OH
/I
OH
of the I/Os at low and high level in
the application.
Table 53. Thermal characteristics
(1)
1. Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection
environment.
Symbol Parameter Value Unit
Θ
JA
Thermal resistance junction-ambient
TSSOP20
110 °C/W
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