Datasheet

ManualsBrandsST ManualsDiodesSchottky Diode, 10A, 45V, TO-220AC

This is information on a product in full production.

September 2012 Doc ID 023252 Rev 1 1/8

STPS1045DEE

Power Schottky rectifier

Datasheet  production data

Features

■ Very low conduction losses

■ Negligible switching losses

■ Extremely fast switching

■ Low thermal resistance

■ Avalanche capacity specified

■ High junction temperature

■ ECOPACK

2 compliant component

Description

This Schottky rectifier is designed for switch mode

power supply and high frequency DC to DC

converters.

Packaged in PowerFLAT™, this device is

intended for use in low voltage, high frequency,

inverters, free-wheeling, by-pass diode and

polarity protection applications.Its low profile was

especially designed to be used in applications

with space-saving constraints.

TM: PowerFLAT is a trademark of STMicroelectronics

Table 1. Device summary

Symbol Value

F(AV)

10 A

RRM

45 V

(max) 175 °C

(typ) 0.45 V

PowerFLAT (3.3 x 3.3)

STPS1045DEE-TR

www.st.com

Summary of content (8 pages)

PAGE 1
STPS1045DEE Power Schottky rectifier Datasheet  production data Features NC ■ Very low conduction losses ■ Negligible switching losses ■ Extremely fast switching ■ Low thermal resistance ■ Avalanche capacity specified ■ High junction temperature ■ ECOPACK®2 compliant component A K A A A A A A NC A A NC K K Description This Schottky rectifier is designed for switch mode power supply and high frequency DC to DC converters.
PAGE 2
Characteristics 1 STPS1045DEE Characteristics Table 2. Absolute ratings (limiting values Tamb = 25 °C unless otherwise specified) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 45 V IF(RMS) Forward rms current 15 A 10 A = 0.
PAGE 3
STPS1045DEE Figure 1. Characteristics Average forward power dissipation Figure 2. versus average forward current PF(AV)(W) Average forward current versus ambient temperature( = 0.5) IF(AV)(A) 12 9 Rth(j-a)=Rth(j-c) 8 δ = 0.5 7 10 δ = 0.2 δ = 0.1 6 8 δ=1 δ = 0.05 5 6 4 3 4 T T 2 2 1 IF(AV)(A) δ =tp/T tp 0 δ =tp/T tp 25 50 Tamb(°C) 0 0 2 4 Figure 3. 1 6 8 10 12 0 14 Normalized avalanche power derating versus pulse duration Figure 4.
PAGE 4
Characteristics Figure 7. STPS1045DEE Forward voltage drop versus forward current Figure 8. IFM(A) Thermal resistance junction to ambient versus copper surface under tab Rth(j-a)(°C/W) 100.0 250 PowerFLAT (3.3x3.3) epoxy printed board FR4, copper thickness=35µm Tj=125 °C (Maximum values) 200 10.0 Tj=25 °C (Maximum values) Tj=125 °C (Typical values) 150 100 1.0 50 SCu(cm²) VFM(V) 0 0.1 0.0 4/8 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.
PAGE 5
STPS1045DEE Package information ● Epoxy meets UL94,V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 9. PowerFLAT-3.3x3.
PAGE 6
Package information STPS1045DEE Figure 10. Footprint (dimensions in mm) 3.50 0.80 0.42 3.50 2.28 1.75 1.75 1.25 1.79 6/8 Doc ID 023252 Rev 1 0.21 0.
PAGE 7
STPS1045DEE 3 Ordering information Ordering information Table 6. 4 Ordering information Order code Marking STPS1045DEE-TR PS1045 Package PowerFLAT (3.3 x 3.3) Weight 34 mg Base qty Delivery mode 3000 Tape and reel 13” reel Revision history Table 7. Document revision history Date Revision 09-Sep-2012 1 Changes First issue.
PAGE 8
STPS1045DEE Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.