Datasheet

Package and PCB thermal data VN5160S-E
24/31 Doc ID 13493 Rev 5
4 Package and PCB thermal data
4.1 SO-8 thermal data
Figure 31. SO-8 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB: FR4 area= 4.8 mm x 4.8 mm, PCB
thickness=2 mm, Cu thickness= 35 µm, Copper areas: from minimum pad lay-out to 2 cm
2
).
Figure 32. R
thj-amb
vs PCB copper area in open box free air condition
60
70
80
90
100
110
0 0.5 1 1.5 2 2.5
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)