Datasheet

Package and PCB thermal data VN750-E
22/38 Doc ID 10891 Rev 7
3.2 PPAK thermal data
Figure 31. PPAK PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 60 mm x 60 mm, PCB
thickness = 2 mm, Cu thickness=35 µm, Copper areas: 0.44 cm
2
, 8 cm
2
).
Table 10. P
2
PAK thermal parameter
Area/island (cm
2
)0.56
R1 (°C/W) 0.15
R2 (°C/W) 0.7
R3 (°C/W) 0.7
R4 (°C/W) 4
R5 (°C/W) 9
R6 (°C/W) 37 22
C1 (W·s/°C) 0.0006
C2 (W·s/°C) 0.0025
C3 (W·s/°C) 0.055
C4 (W·s/°C) 0.4
C5 (W·s/°C) 2
C6 (W·s/°C) 3 5
GAPGRI00172