Datasheet

VNS1NV04DP-E Package and PCB thermal data
Doc ID 17344 Rev 3 17/24
4 Package and PCB thermal data
4.1 SO-8 thermal data
Figure 30. SO-8 PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB FR4 area = 58 mm x 58 mm, PCB
thickness = 2 mm, Cu thickness = 35 µm, Copper areas: from minimum pad lay-out to
0.8 cm
2
).
Figure 31. R
thj-amb
vs PCB copper area in open box free air condition
80
85
90
95
100
105
110
115
0 0,1 0,2 0,3 0,4 0,5 0,6 0,7
PCB Cu heatsink area (cm^ 2) - (refer to PCB layout)
RTH
J
_amb (°C/W)