Datasheet

ManualsBrandsST ManualsDiscrete SemiconductorsThyristor, TO-92, 600V, 1.25A

January 2011 Doc ID 7480 Rev 4 1/11

X02

1.25 A sensitive gate SCR

Features

■ on-state rms current: 1.25 A

■ repetitive peak off-state voltage: 600 V and

800 V

■ gate triggering current:

50 and 200 µA

Applications

■ ground fault circuit interrupters

■ overvoltage crowbar protection in power

supplies

■ capacitive ignition circuits

Description

The X02 SCR can be used as the on/off function

in applications where topology does not offer high

current for gate triggering.

This device is optimized in forward voltage drop

and inrush current capabilities for reduced power

losses and high reliability in harsh environments.

SOT-223

X02xxN

TO-92

X02xxA

SMBflat-3L

X0202NUF

Table 1. Device summary

Order code

Voltage

Sensitivity µA Package

600 V 800 V

X0202MA Y 200 TO-92

X0202MN Y 200 SOT-223

X0202NA Y 200 TO-92

X0202NN Y 200 SOT-223

X0205MA Y 50 TO-92

X0205NA Y 50 TO-92

X0202NUF Y 200 SMBflat-3L

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Summary of content (11 pages)

PAGE 1
X02 1.25 A sensitive gate SCR Features A ■ on-state rms current: 1.25 A ■ repetitive peak off-state voltage: 600 V and 800 V ■ G K gate triggering current: 50 and 200 µA A Applications ground fault circuit interrupters ■ overvoltage crowbar protection in power supplies ■ A G ■ A K K TO-92 X02xxA SOT-223 X02xxN capacitive ignition circuits Description A The X02 SCR can be used as the on/off function in applications where topology does not offer high current for gate triggering.
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Characteristics X02 1 Characteristics Table 2. Absolute ratings (limiting values, TJ = 25 °C unless otherwise specified) Symbol IT(RMS) Parameter On-state rms current (180 °Conduction angle) TO-92 TL = 63 °C SOT-223 Ttab = 99 °C Value Unit 1.25 A 0.8 A SMBflat-3L Ttab = 111 °C IT(AV) Average on-state current (180 °Conduction angle) TO-92 TL = 63 °C SOT-223 Ttab = 99 °C SMBflat-3L Ttab = 111 °C ITSM I²t tp = 8.
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X02 Characteristics Table 5. Thermal resistances Symbol Parameter Value Rth(j-l) Junction to leads (DC) TO-92 60 Rth(j-t) Junction to tab (DC) SOT-223 25 Rth(j-t) Junction to tab (DC) SMBflat-3L Junction to ambient (DC) Figure 1. 1.2 14 Max. Rth(j-a) S = 5 cm2 Maximum average power dissipation versus average on-state current (full cycle) Figure 2. P(W) 1.
PAGE 4
Characteristics Figure 5. X02 Relative variation of triggering, Figure 6. holding and latching current versus junction temperature Relative variation of holding current versus gate-cathode resistance (typical values) IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 1.50 IH[RGK] / IH[RGK=1kΩ] Typical values 4.0 1.25 Tj=25 3.5 3.0 1.00 2.5 0.75 IH & IL RGK = 1kΩ 2.0 1.5 0.50 1.0 IGT 0.5 0.25 0.00 -40 -20 Figure 7. 0 20 40 RGK(kΩ) 0.0 1.E-02 Tj(°C) 60 80 100 120 1.E-01 1.E+00 1.
PAGE 5
X02 Ordering information scheme Figure 11. On-state characteristics (maximum Figure 12. Thermal resistance junction to values) ambient versus copper surface under tab (SOT-223, SMBflat-3L) ITM(A) 170 160 150 140 130 120 110 100 90 80 70 60 50 3E+1 Tj max.: Vt0=0.9V Rd=200mΩ 1E+1 Tj=max 1E+0 Tj=25°C VTM(V) 1E-1 0.5 2 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.
PAGE 6
Package information 3 X02 Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. TO-92 dimensions Dimensions Ref Millimeters Min. Typ. Max. Inches Min. Typ. Max. A a B A 1.35 B C 4.
PAGE 7
X02 Package information Table 7. SOT-223 dimensions Dimensions Ref. V A A1 Millimeters Min. c Typ. A B A1 e1 Inches Max. Min. Typ. Max. 1.80 0.071 0.02 0.10 0.001 0.004 B 0.60 0.70 0.85 0.024 0.027 0.033 B1 2.90 3.00 3.15 0.114 0.118 0.124 c 0.24 0.26 0.35 0.009 0.010 0.014 (1) 6.30 6.50 6.70 0.248 0.256 0.264 D B1 D 4 H E 1 2 e 3 2.3 e1 0.090 4.6 0.181 E(1) 3.30 3.50 3.70 0.130 0.138 0.146 H 6.70 7.00 7.30 0.264 0.276 0.287 e V 10° max 1.
PAGE 8
Package information Table 8. X02 SMBflat-3L dimensions Dimensions Ref. A c e D b 2x L2 2x L 2x L1 E E1 Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 0.35 0.65 0.014 0.026 b4 1.95 2.20 0.07 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.156 0.181 L 0.75 1.50 0.030 0.059 L1 L L2 b4 L1 0.40 0.016 L2 0.60 0.024 e 1.60 0.063 Figure 15. SMBflat-3L footprint dimensions 5.
PAGE 9
X02 Package information Figure 16. Footprint and connectors for SOT-223 or SMBflat-3L (dimensions in mm) 5.84 3.42 3.25 1.19 1.32 1.50 2.92 SOT-223 Solder resist 1.35 1.20 1.08 Solder lands SMBF3L 7.80 2.07 2.22 SMBF3L 1.95 SMBF3L 2.07 0.61 0.51 0.46 1.30 1.20 1.08 Solder paste 1.47 1.32 1.19 Connector line SOT-223 SOT-223 SOT-223 0.85 0.95 1.10 2.
PAGE 10
Ordering information 4 Ordering information Table 9. 5 Ordering information Order code Marking Package Weight Base qty Delivery mode X0202MA 1BA2 X0202 MA TO-92 0.2 g 2500 Bulk X0202MA 2BL2 X0202 MA TO-92 0.2 g 2000 Ammopack X0202MN5BA4 X2M SOT-223 0.12 g 1000 Tape and reel X0202NA 1BA2 X0202 NA TO-92 0.2 g 2500 Bulk X0202NA 2BL2 X0202 NA TO-92 0.2 g 2000 Ammopack X0202NN5BA4 X2N SOT-223 0.12 g 1000 Tape and reel X0205MA 1BA2 X0205 MA TO-92 0.
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X02 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.