Datasheet

Technical Data Sheet
TDB_LD_Kristall_Serie_EN Page 1 of 2 Issue: 27.08.12
STANNOL GmbH
Oskarstraße 3-7 • 42283 Wuppertal • Tel. [phone] • Telefax [phone] • E-Mail [e-mail] • Web www.stannol.de
Wenn’s ums Löten geht
When it’s about soldering
Quand il s’agit du soudage
®
STANNOL
STANNOL
®
solder wires of the Kristall-Series
NO-CLEAN SOLDER WIRES WITH CLEAR RESIDUES
Description
STANNOL
®
Kristall solder wires have been specially formulated to complement No Clean wave and reflow soldering processes.
They are also applicable to repair operations carried out after a cleaning process, eliminating the need for further cleaning.
STANNOL
®
Kristall 400 is designed for users who require a halide free formulation.
STANNOL
®
Kristall 502, 505 and 511 contain different halide levels with maximised soldering power
STANNOL
®
Kristall 400, 502, 505 and 511 cored wires are manufactured with a range of flux contents.
Although users will normally be using products with a nominal flux content of 3%, the superior performance of the
®
Kristall products
may allow a lower flux content to be specified e.g. 2.2%. This will further improve residue appearance by reducing the quantity. All
are available in alloys conforming to national and international standards, including lead free alloys. Some alloys and flux contents
may be manufactured to special order.
STANNOL
®
Kristall solid fluxes are based on modified rosins and carefully selected activators. In use they exhibit a mild rosin odour
and leave a small quantity of clear residue. The used activated resin shows the following advantages:
 halide free version
• Kristall 400
 clear residues
 fast soldering
• wide range of activities to suit all
applications
 heat stable
• low spitting
 good spread
• on copper, brass and nickel
 mild odour
STANNOL
®
Kristall solder wires provide fast soldering on copper and brass surfaces as well as solder coated materials. Activity of
the halide activated versions on nickel is also good depending on the state of oxidation of the nickel finish. The good thermal stability
of STANNOL
®
Kristall fluxes means they are also well suited to soldering applications requiring high melting temperature alloys. The
resin and flux systems are designed to leave relatively low residues and to minimise residual activity. This is achieved by ensuring
some decomposition and volatilisation takes place during the soldering process. In some situations, this may generate visible fuming
but in all cases, rosin fumes must be removed from the breathing zone of operators.
Application
Soldering iron: Good results should be obtained using a range of tip temperatures. However, the optimum tip temperature and heat
capacity required for a hand soldering process is a function of both soldering iron design and the nature of the task and care should
be exercised to avoid unnecessarily high tip temperatures for excessive times. A high tip temperature will increase any tendency to
flux spitting and it may produce some residue darkening.
The soldering iron tip should be properly tinned and this may be achieved using STANNOL
®
Kristall cored wire. Severely
contaminated soldering iron tips should first be cleaned and pre-tinned using STANNOL
®
Tippy, then wiped on a clean, damp
sponge before re-tinning with Kristall cored wire.
Soldering process: STANNOL
®
Kristall flux cored wires contain a careful balance of resins and activators to provide clear residues,
maximum activity and high residue reliability, without cleaning in most situations. To achieve the best results from STANNOL
®
Kristall solder wires, recommended working practices for hand soldering should be observed as follows:
a) Apply the soldering iron tip to the work surface, ensuring that it simultaneously contacts the base material and the component
termination to heat both surfaces adequately. This process should only take a fraction of a second.
b) Apply Kristall flux cored solder wire to a part of the joint surface away from the soldering iron and allow to flow sufficiently to form
a sound joint fillet - this should be virtually instantaneous. Do not apply excessive solder or heat to the joint as this may result in dull,
gritty fillets and excessive or darkened flux residues.
c) Remove solder wire from the workpiece and then remove the iron tip.
d) The total process will be very rapid, depending upon thermal mass, tip temperature and configuration and the solderability of the
surfaces to be joined.
Cleaning: STANNOL
®
Kristall flux cored solder wires have been formulated to leave pale flux residues and to resist spitting and
fuming. In most industrial and consumer electronics applications cleaning will not be required and the product may therefore be used
to complement a No Clean wave soldering or reflow process or to allow repairs to cleaned boards without the need for a second
cleaning process.