Data Sheet

12/19
DocID027851 Rev 1.0
BLUENRG-M0x
The BLUENRG-M0x is a high temperature strength surface mount Bluetooth
®
module
supplied on a 11 pin, 4-layer PCB. The final assembly recommended reflow profiles are
indicated here below.
Soldering phase has to be executed with care: in order to avoid undesired melting
phenomenon, particular attention has to be taken on the set up of the peak
temperature.
Here following some suggestions for the temperature profile based on
following recommendations.
Table 6. Soldering profile
Profile feature
PB-free assembly
Average ramp up rate (T
SMAX
to T
p
)
3°C/ sec max
Preheat
Temperature min (T
S
mn)
Temperature max (T
S
max)
Time (t
S
min to t
S
max) (t
S
)
150 °C
200 °C
60-100 sec
Time maintained above:
Temperature T
L
Time t
L
217 °C
60-70 sec
Peak temperature (T
P
)
240 + 0 °C
Time within 5 °C of actual peak temperature (T
P
)
10-20 sec
Ramp down rate
6 °C/sec
Time from 25 °C to peak temperature
8 minutes max
Figure 11. Soldering profiles