Datasheet

ManualsBrandsSTMICROELECTRONICS ManualsDiodesTVS Diode

This is information on a product in full production.

March 2014 DocID023702 Rev 2 1/9

ESDAXLC6-1BU2

Single-line bidirectional ESD protection for high speed interface

Datasheet

production data

Figure 1. Functional diagram (top view)

Features

• Bidirectional device

• Extra low diode capacitance: 0.4 pF

• Low leakage current

• 0201 SMD package size compatible

• Ultra small PCB area: 0.18 mm

• ECOPACK

2 and RoHS compliant component

Complies with the following standards:

• IEC 61000-4-2 level 4

– ±15 kV (air discharge)

– ±8 kV (contact discharge)

Applications

Where transient overvoltage protection in ESD

sensitive equipment is required, such as:

• Smartphones, mobile phone and accessories

• Tablet PCs, netbooks and notebooks

• Portable multimedia devices and accessories

• Digital cameras and camcorders

• Communication and highly integrated systems

Description

The ESDAXLC6-1BU2 is a bidirectional single

line TVS diode designed to protect the data lines

or other I/O ports against ESD transients.

The device is ideal for applications where both

reduced line capacitance and board space saving

are required.

0201 package

Pin 1 available in different forms

Pin1

www.st.com

Summary of content (9 pages)

PAGE 1
ESDAXLC6-1BU2 Single-line bidirectional ESD protection for high speed interface Datasheet - production data Features • Bidirectional device • Extra low diode capacitance: 0.4 pF • Low leakage current • 0201 SMD package size compatible • Ultra small PCB area: 0.18 mm2 • ECOPACK®2 and RoHS compliant component Complies with the following standards: 0201 package Pin 1 available in different forms Figure 1.
PAGE 2
Characteristics ESDAXLC6-1BU2 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit ± 16 ± 25 kV VPP Peak pulse voltage: IEC 61000-4-2 contact discharge IEC 61000-4-2 air discharge PPP Peak pulse power (8/20 µs) 40 W IPP Peak pulse current (8/20 µs) 1.
PAGE 3
ESDAXLC6-1BU2 Characteristics Figure 3. Leakage current versus junction temperature (typical values) Figure 4. Junction capacitance versus applied voltage (typical values) IR(nA) 10.00 C (pF) 1.0 VR = 3 V Direct/Reverse Vosc = 30 mVRMS Tj = 25°C direct / reverse 0.8 1.00 0.6 0.4 0.10 0.2 VR(V) Tj(°C) 0.0 0.01 25 35 45 55 65 75 85 95 0 105 115 125 135 145 Figure 5. ESD response to IEC 61000-4-2 (+8 kV contact discharge) 50 V/div 1 2 4 5 Figure 6.
PAGE 4
Package information 2 ESDAXLC6-1BU2 Package information • Epoxy meets UL94, V0 • Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 8.
PAGE 5
ESDAXLC6-1BU2 Package information Figure 9. Footprint dimensions in mm (inches) 0.243 (0.0096) 0.656 (0.0258) Figure 10. Marking 0.243 (0.0096) Z2 Pin2 0.300 (0.0118) Pin 1 0.170 (0.0067) Product marking may be rotated by 180° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Figure 11. Tape and reel specifications Bar indicates Pin 1 Ø 1.55 4.0 2.0 3.5 0.67 1.
PAGE 6
Recommendation on PCB assembly ESDAXLC6-1BU2 3 Recommendation on PCB assembly 3.1 Stencil opening design Figure 12. Recommended stencil windows position 0.230 (0.0091) 0.643 (0.0253) 0.183 (0.0072) 0.285 (0.0112) 0.008 (0.0003) 0.300 (0.0118) 0.008 (0.0003) 0.656 (0.0258) 0.007 0.007 (0.00027) (0.00027) 0.170 (0.0067) 0.243 (0.0096) mm (inches) Footprint 3.2 6/9 Stencil window Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2.
PAGE 7
ESDAXLC6-1BU2 3.3 3.4 3.5 Recommendation on PCB assembly Placement 1. Manual positioning is not recommended. 2. It is recommended to use the lead recognition capabilities of the placement system, not the outline centering 3. Standard tolerance of ± 0.05 mm is recommended. 4. 3.5 N placement force is recommended. Too much placement force can lead to squeezed out solder paste and cause solder joints to short.
PAGE 8
Ordering information 4 ESDAXLC6-1BU2 Ordering information Figure 14. Ordering information scheme ESDA XLC 6 - 1B U2 ESDA array Extra low capacitance Breakdown voltage 6 = 6 V min Direction B = Bidirectional Package U2 = ST0201 Table 4. Ordering information Order code Marking (1) ESDAXLC6-1BU2 Z2 Weight Base qty Delivery mode 0.124 mg 15000 Tape and reel 1. The marking can be rotated by 180° to differentiate assembly location 5 Revision history Table 5.
PAGE 9
ESDAXLC6-1BU2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.