Datasheet

Thermal map AN3172
18/31 Doc ID 17230 Rev 1
5 Thermal map
In order to check the design reliability, a thermal mapping by means of an IR Camera was
done. In Figure 16 and 17 the thermal measurements of the board, component side, at
nominal input voltage, are shown. Some pointers, visible in the images, have been placed
across key components or showing high temperature. The ambient temperature during both
measurements was 27 °C.
Figure 16. Thermal map at 115 Vac - 60 Hz - full load
Figure 17. Thermal map at 230 Vac - 50 Hz - full load