Datasheet

L6234 Thermal data

Doc ID 1107 Rev 10 5/16

3 Thermal data

Figure 3. Printed Heatsink

Table 3. Thermal data

Symbol Parameter DIP16+2+2 PowerSO20 Unit

th j-pin

Thermal resistance, junction to pin 12

(1)

1. The thermal resistance is referred to the thermal path from the dissipating region on the top surface of the

silicon chip, to the points along the four central pins of the package, at a distance of 1.5 mm away from the

stand-offs.

– °C/W

th j-amb1

Thermal resistance, junction to ambient 40

(2)

2. If a dissipating surface, thick at least 35 mm, and with a surface similar or bigger than the one shown in

Figure 3, is created making use of the printed circuit. Such heatsinking surface is considered on the bottom

side of an horizontal PCB (worst case).

– °C/W

th j-amb2

Thermal resistance, junction characteristics) to

ambient

(3)

3. If the power dissipating pins (the four central ones), as well as the others, have a minimum thermal

connection with the external world (very thin strips only) so that the dissipation takes place through still air

and through the PCB itself. It is the same situation of note 2, without any heatsinking surface created on

purpose on the board.

– °C/W

th j-case

Thermal resistance junction-case – 1.5 °C/W

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