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September 2011 Doc ID 4146 Rev 4 1/7

SMLVT3V3

Low voltage Transil™

Features

■ Peak pulse power 600 W (10/1000 μs)

■ Stand off voltage 3.3 V

■ Unidirectional type

■ Low clamping factor

■ Fast response time

■ JEDEC registered package outline

Description

The SMLVT3V3 is a Transil diode designed

specifically to protect sensitive 3.3 V equipment

against transient overvoltages.

Transil diodes provide high overvoltage protection

by clamping action. Their instantaneous response

to transient overvoltages make them particularly

suited to protect voltage sensitive devices such as

MOS technology and low voltage supplied ICs.

TM: Transil is a trademark of STMicroelectronics

SMB

(JEDEC DO-214AA)

www.st.com

Summary of content (7 pages)

PAGE 1
SMLVT3V3 Low voltage Transil™ Features ■ Peak pulse power 600 W (10/1000 μs) ■ Stand off voltage 3.3 V ■ Unidirectional type ■ Low clamping factor ■ Fast response time ■ JEDEC registered package outline A K SMB (JEDEC DO-214AA) Description The SMLVT3V3 is a Transil diode designed specifically to protect sensitive 3.3 V equipment against transient overvoltages. Transil diodes provide high overvoltage protection by clamping action.
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Characteristics 1 SMLVT3V3 Characteristics Table 1.
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SMLVT3V3 Figure 1. Characteristics Pulse waveform Repetitive pulse current tr = rise time (µs) tp = pulse duration time (µs) tp tr Figure 2. Peak pulse power dissipation versus initial junction temperature (printed circuit board) PPP[Tj initial] PPP[Tj initial = 25° C] 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 Figure 3. 100.0 Peak pulse power versus exponential pulse duration PPP(kW) Tj initial = 25 °C 10.0 1.0 tP(ms) Tj initial (°C) 0.1 1.0E-03 0 25 Figure 4.
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Order information scheme Figure 6. SMLVT3V3 Peak forward voltage drop versus peak forward current (typical values) Figure 7. Transient thermal impedance, junction to ambient, versus pulse duration (PCB - FR4) Zth(j-a) / Rth(j-a) 1.00 Recommended pad layout 0.10 tP(µs) 0.01 1.0E-03 1.0E-02 1.0E-01 1.0E+00 Figure 8. Relative variation of leakage current versus junction temperature 2 Order information scheme Figure 9. 1.
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SMLVT3V3 3 Package information Package information ● Case: JEDEC DO-214AA molded plastic over Planar junction ● Epoxy meets UL94, V0 ● RoHS compliant package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMB Dimensions Dimensions E1 Ref.
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Ordering information 4 Ordering information Table 6. 5 Ordering information Order code Marking Package Weight Base qty Delivery mode SMLVT3V3 CD SMB 0.12 g 2500 Tape and reel Revision history Table 7. 6/7 SMLVT3V3 Document revision history Date Revision Changes Aug-2001 2 Previous issue 25-Apr-2007 3 Reformatted to current standards. Added cathode bar marker in cover page graphics and Figure 11. 14-Sep-2011 4 Updated Junction temperature range in Table 1.
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SMLVT3V3 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.