Datasheet

ManualsBrandsSTMICROELECTRONICS ManualsDiodesSMP100MC-400

February 2012 Doc ID 9699 Rev 5 1/13

SMP100MC

Trisil™ for telecom equipment protection

Features

■ Bidirectional crowbar protection

■ Voltage: range from 140 V to 400 V

■ Low V

/ V

ratio

■ Micro capacitance from 15 pF to 30 pF @ 50 V

■ Low leakage current: I

= 2 µA max

■ Holding current: I

= 150 mA min.

■ Repetitive peak pulse current:

= 100 A (10/1000 µs)

Benefits

■ Trisils are not subject to ageing and provide a

fail safe mode in short circuit for better

protection.

■ Helps equipment meet main standards such as

UL60950, IEC 950 / CSA C22.2 and UL1459.

■ Epoxy meets UL94, V0.

■ Package is JEDEC registered (DO-214AA).

Complies with the following standards

■ GR-1089 Core

■ ITU-T-K20/K21

■ IEC 61000-4-5

■ TIA/EIA IS-968

■ UL497B recognized, UL file E136224

Applications

Any sensitive equipment requiring protection

against lightning strikes and power crossing:

■ Terminals (phone, fax, modem...) and central

office equipment

■ ADSL2+ and low end VDSL

Description

The SMP100MC is a series of micro capacitance

transient surge arrestors designed for the

protection of high debit rate communication

equipment. Its micro capacitance avoids any

distortion of the signal and is compatible with

digital transmission line cards (ADSL, VDSL,

ISDN...).

SMP100MC series has been tested and

confirmed compatible with Cooper Bussmann

Telecom Circuit Protector TCP 1.25 A.

TM: Trisil is a trademark of STMicroelectronics.

SMB

(JEDEC DO-214AA)

www.st.com

Summary of content (13 pages)

PAGE 1
SMP100MC Trisil™ for telecom equipment protection Features ■ Bidirectional crowbar protection ■ Voltage: range from 140 V to 400 V ■ Low VBO / VR ratio ■ Micro capacitance from 15 pF to 30 pF @ 50 V ■ Low leakage current: IR = 2 µA max ■ Holding current: IH = 150 mA min. ■ Repetitive peak pulse current: IPP = 100 A (10/1000 µs) SMB (JEDEC DO-214AA) Benefits ■ Trisils are not subject to ageing and provide a fail safe mode in short circuit for better protection.
PAGE 2
Characteristics 1 SMP100MC Characteristics Table 1. 2/13 In compliance with the following standards Waveform voltage Required peak current (A) Current waveform Minimum serial resistor to meet standard (Ω) 2500 1000 2/10 µs 10/1000 µs 500 100 2/10 µs 10/1000 µs 0 0 GR-1089 Core Second level 5000 2/10 µs 500 2/10 µs 0 GR-1089 Core Intra-building 1500 2/10 µs 100 2/10 µs 0 ITU-T-K20/K21 6000 1500 10/700 µs 150 37.
PAGE 3
SMP100MC Characteristics Table 2. Absolute ratings (Tamb = 25 °C) Symbol Parameter Value Units 10/1000 µs 8/20 µs 10/560 µs 5/310 µs 10/160 µs 1/20 µs 2/10 µs 100 300 140 150 200 300 500 A 8/20 µs 5 kA t = 0.2 s t=1s t=2s t = 15 mn 18 9 7 4 A t = 16.6 ms t = 20 ms 20 21 A²s Storage temperature range -55 to 150 °C Tj Operating junction temperature range -40 to 150 °C TL Maximum lead temperature for soldering during 10 s.
PAGE 4
Characteristics SMP100MC Table 4. Electrical characteristics - values (Tamb = 25 °C) IRM @ VRM Types IR @ VR max. µA Dynamic Static VBO (1) VBO @ IBO(2) max. V µA C(4) C(5) max. max. max. min. typ. typ.
PAGE 5
SMP100MC Figure 2. Characteristics Pulse waveform %IPP Figure 3. ITSM(A) Repetitive peak pulse current 70 tr = rise time (µs) F=50Hz Tj initial = 25°C tp = pulse duration time (µs) 100 Non repetitive surge peak on-state current versus overload duration 60 50 40 50 30 20 10 0 tr Figure 4. t tp t(s) 0 1.E-02 On-state voltage versus on-state current (typical values) 1.E-01 Figure 5. IT(A) 1.E+00 1.E+01 1.E+02 1.
PAGE 6
Application information Figure 8. SMP100MC Variation of thermal impedance junction to ambient versus pulse duration Figure 9. Zth(j-a)/Rth(j-a) C [VR] / C [VR=2V] 1.0 0.9 0.8 Relative variation of junction capacitance versus reverse voltage applied (typical values) 1.2 Printed circuit board - FR4, copper thickness = 35µm, recommended pad layout F =1MHz VOSC = 1VRMS Tj = 25°C 1.1 1.0 0.9 0.7 0.8 0.6 0.7 0.5 0.6 0.4 0.5 0.4 0.3 0.3 0.2 0.2 0.1 tp(s) 1.E-02 2 VR(V) 0.1 0.0 0.0 1.
PAGE 7
SMP100MC Application information Figure 11. Typical circuits Fuse TCP 1.25A Tip L Tip S Fuse TCP 1.25A SMP100MC-xxx T1 SMP100MC-xxx Gnd Gnd SMP100MC-xxx T2 Fuse TCP 1.25A Ring L Typical circuit for subscriber side Ring S Typical circuit for central office side Figure 12. Test method of the board having fuse and Trisil I surge Surge Generator Line side Device to be protected Test board V Oscilloscope Current probe Voltage probe These topologies, using SMP100MC from ST and TCP1.
PAGE 8
Application information SMP100MC Figure 14. Trisil action while the fuse remains operational Test conditions: 600 V 3 A 1.1 s (first level), Tamb = 25 °C Test result: Fuse and Trisil OK after test in accordance with GR1089 requirements Figure 15. High current power cross test: the fuse acts like a switch by opening the circuit Test conditions: 277 V 25 A (second level), Tamb = 25 °C Test result: Fuse safety opened and Trisil OK after test in accordance with GR1089 requirements.
PAGE 9
SMP100MC Application information Figure 16. Test circuit 1 for Dynamic IBO and VBO parameters 100 V / µs, di /dt < 10 A / µs, Ipp = 100 A 2Ω 83 Ω 45 Ω 10 µF U 66 Ω 46 µH 0.36 nF 470 Ω KeyTek 'System 2' generator with PN246I module 1 kV / µs, di /dt < 10 A / µs, Ipp = 10 A 250 Ω 26 µH 60 µF U 46 µH 47 Ω 12 Ω KeyTek 'System 2' generator with PN246I module Figure 17.
PAGE 10
Ordering information scheme SMP100MC Figure 18. Test circuit 3 for dynamic IH parameter R Surge generator D.U.T VBAT = - 48 V This is a GO-NOGO test which allows to confirm the holding current (IH) level in a functional test circuit. TEST PROCEDURE 1/ Adjust the current level at the IH value by short circuiting the AK of the D.U.T. 2/ Fire the D.U.T. with a surge current ➔ IPP = 10 A, 10/1000 µs. 3/ The D.U.T. will come back off-state within 50 ms maximum. 3 Ordering information scheme Figure 19.
PAGE 11
SMP100MC 4 Package information Package information ● Epoxy meets UL94, V0 ● Lead-free package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 5. SMB dimensions Dimensions Ref. Millimeters Inches E1 D E A1 A2 C L b Figure 20.
PAGE 12
Ordering information 5 Ordering information Table 6. 6 Ordering information Part Number Marking SMP100MC-140 ML14 SMP100MC-160 ML16 SMP100MC-200 ML20 SMP100MC-230 ML23 SMP100MC-270 ML27 SMP100MC-320 ML32 SMP100MC-360 ML36 SMP100MC-400 ML40 Package Weight Base qty Delivery mode SMB 98 mg 2500 Tape and reel Revision history Table 7.
PAGE 13
SMP100MC Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.