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October 2011 Doc ID 11265 Rev 5 1/14

USBLC6-2

Very low capacitance ESD protection

Features

■ 2 data-line protection

■ Protects V

BUS

■

Very low capacitance: 3.5 pF max.

■ Very low leakage current: 150 nA max.

■ SOT-666 and SOT23-6L packages

■ RoHS compliant

Benefits

■ Very low capacitance between lines to GND for

optimized data integrity and speed

■ Low PCB space consumption: 2.9 mm

max for

SOT-666 and 9 mm² max for SOT23-6L

■ Enhanced ESD protection: IEC 61000-4-2

level 4 compliance guaranteed at device level,

hence greater immunity at system level

■ ESD protection of V

BUS

■

High reliability offered by monolithic integration

■ Low leakage current for longer operation of

battery powered devices

■ Fast response time

■ Consistent D+ / D- signal balance:

– Very low capacitance matching tolerance

I/O to GND = 0.015 pF

– Compliant with USB 2.0 requirements

Complies with the following standards:

■ IEC 61000-4-2 level 4:

– 15 kV (air discharge)

– 8 kV (contact discharge)

Figure 1. Functional diagram (top view)

Applications

■ USB 2.0 ports up to 480 Mb/s (high speed)

■ Compatible with USB 1.1 low and full speed

■ Ethernet port: 10/100 Mb/s

■ SIM card protection

■ Video line protection

■ Portable electronics

Description

The USBLC6-2SC6 and USBLC6-2P6 are

monolithic application specific devices dedicated

to ESD protection of high speed interfaces, such

as USB 2.0, Ethernet links and video lines.

The very low line capacitance secures a high level

of signal integrity without compromising in

protecting sensitive chips against the most

stringently characterized ESD strikes.

SOT23-6L

USBLC6-2SC6

SOT-666

USBLC6-2P6

I/O1 I/O1

GND V

BUS

I/O2 I/O2

www.st.com

Summary of content (14 pages)

PAGE 1
USBLC6-2 Very low capacitance ESD protection Features ■ 2 data-line protection ■ Protects VBUS ■ Very low capacitance: 3.5 pF max. ■ Very low leakage current: 150 nA max. ■ SOT-666 and SOT23-6L packages ■ RoHS compliant SOT23-6L USBLC6-2SC6 Figure 1. SOT-666 USBLC6-2P6 Functional diagram (top view) Benefits ■ Very low capacitance between lines to GND for optimized data integrity and speed ■ Low PCB space consumption: 2.
PAGE 2
Characteristics 1 USBLC6-2 Characteristics Table 1. Absolute ratings Symbol Parameter IEC 61000-4-2 air discharge IEC 61000-4-2 contact discharge MIL STD883G-Method 3015-7 Value Unit 15 15 25 kV VPP Peak pulse voltage Tstg Storage temperature range -55 to +150 °C Tj Operating junction temperature range -40 to +125 °C TL Lead solder temperature (10 seconds duration) 260 °C Table 2. Electrical characteristics (Tamb = 25 °C) Value Symbol Parameter Test conditions Unit Min.
PAGE 3
USBLC6-2 Figure 2. Characteristics Capacitance versus voltage (typical values) Figure 3. Line capacitance versus frequency (typical values) C(pF) C(pF) 2.8 3.0 2.6 CO=I/O-GND 2.4 2.5 VOSC=30mVRMS Tj=25°C VLINE=0V to 3.3V 2.2 2.0 F=1MHz VOSC=30mVRMS Tj=25°C 2.0 1.8 1.6 1.4 1.5 Cj=I/O-I/O 1.2 1.0 1.0 0.8 0.6 0.5 0.4 Data line voltage (V) 0.2 0.0 F(MHz) 0.0 0.0 0.5 Figure 4. 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.
PAGE 4
Technical information USBLC6-2 2 Technical information 2.1 Surge protection The USBLC6-2 is particularly optimized to perform surge protection based on the rail to rail topology. The clamping voltage VCL can be calculated as follow: VCL+ = VTRANSIL + VF for positive surges VCL- = - VF for negative surges with: VF = VT + Rd.Ip (VF forward drop voltage) / (VT forward drop threshold voltage) and VTRANSIL = VBR + Rd_TRANSIL.
PAGE 5
USBLC6-2 Technical information We can significantly reduce this phenomena with simple layout optimization. It is for this reason that some recommendations have to be followed (see 2.3: How to ensure good ESD protection). Figure 6.
PAGE 6
Technical information Figure 9. USBLC6-2 ESD response to IEC 61000-4-2 (+15 kV air discharge) Figure 10. ESD response to IEC 61000-4-2 (-15 kV air discharge) Vin Vin Vout Vout Important: A good precaution to take is to put the protection device as close as possible to the disturbance source (generally the connector). 2.4 Crosstalk behavior 2.4.1 Crosstalk phenomenon Figure 11.
PAGE 7
USBLC6-2 Technical information Figure 12. Analog crosstalk measurements TEST BOARD USBLC6-2SC6 NETWORK ANALYSER PORT 2 NETWORK ANALYSER PORT 1 Vbus Figure 12. shows the measurement circuit for the analog application. In usual frequency range of analog signals (up to 240 MHz) the effect on disturbed line is less than -55 dB (see Figure 13.). Figure 13. Analog crosstalk results dB 0.00 - 30.00 - 60.00 - 90.00 F (Hz) - 120.00 100.0k 1.0M 10.0M 100.0M 1.
PAGE 8
Technical information 2.5 USBLC6-2 Application examples Figure 14. USB 2.0 port application diagram using USBLC6-2 + 3.3V DEVICEUPSTREAM RPU TRANSCEIVER SW2 + 5V USB connector SW1 VBUS RX LS/FS + RX HS + TX HS + RX LS/FS RX HS TX HS GND TX LS/FS + TX LS/FS - Protecting Bus Switch VBUS RX LS/FS + RX HS + TX HS + RX LS/FS RX HS TX HS - VBUS D+ DGND RS RS RS USBLC6-2SC6 RS RPD + 3.
PAGE 9
USBLC6-2 2.6 Technical information PSpice model Figure 16. shows the PSpice model of one USBLC6-2 cell. In this model, the diodes are defined by the PSpice parameters given in Figure 17. Figure 16. PSpice model LI/O RI/O RI/O LI/O D+in D+out MODEL = Dlow LGND RGND MODEL = Dhigh RI/O MODEL = Dzener LI/O GND VBUS MODEL = Dlow LI/O MODEL = Dhigh RI/O RI/O LI/O D-in D-out Note: This simulation model is available only for an ambient temperature of 27 °C. Figure 17.
PAGE 10
Ordering information scheme 3 USBLC6-2 Ordering information scheme Figure 19.
PAGE 11
USBLC6-2 4 Package information Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 3. SOT-666 dimensions Dimensions b1 L1 Ref. Millimeters Min. D E A3 0.08 0.18 0.003 0.007 b 0.17 0.34 0.
PAGE 12
Package information Table 4. USBLC6-2 SOT23-6L dimensions Dimensions Ref. Millimeters Min. c A1 q L H A E D e Figure 22. SOT23-6L footprint dimensions in mm A1 0 A2 0.90 1.30 0.035 0.051 b 0.35 0.50 0.014 0.020 c 0.09 0.20 0.004 0.008 D 2.80 3.05 0.11 0.118 E 1.50 1.75 0.059 0.069 0.10 0.004 0 0.95 0.037 H 2.60 3.00 0.102 0.118 L 0.10 0.60 0.004 0.024 θ 0° 10° Figure 23. SOT23-6L marking UL26 0.95 12/14 Max. 0.057 1.20 2.30 Typ. 1.45 0.035 0.60 3.
PAGE 13
USBLC6-2 5 Ordering information Ordering information Table 5. 6 Ordering information Order code Marking Package Weight Base qty Delivery mode USBLC6-2SC6 UL26 SOT23-6L 16.7 mg 3000 Tape and reel USBLC6-2P6 F SOT-666 2.9 mg 3000 Tape and reel Revision history Table 6. Document revision history Date Revision Changes 14-Mar-2005 1 First issue. 07-Jun-2005 2 Format change to figure 3; no content changed. 20-Mar-2008 3 Added marking illustrations - Figures 21 and 23.
PAGE 14
USBLC6-2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.