Datasheet

Package and PC board thermal data VNI4140K
14/25 DocID14174 Rev 13
8 Package and PC board thermal data
8.1 VNI4140K thermal data
Figure 10. VNI4140K PC board
Note: Layout condition of R
th
and Z
th
measurements (PCB: double layer, thermal vias, FR4
area =77 mm x 86 mm, PCB thickness =1.6 mm, Cu thickness = 70 mm (front and back
side), copper areas: from minimum pad layout to 8 cm
2
).
Figure 11. R
th(JA)
vs. PCB copper area in open box free air condition (one channel ON)