User's Manual

Summit User’s Guide – SDC-SSD40L

SDC-SSD40L_UsersGuide

Solder Stencil Opening for Pads: 1:1 to 1:0.9 (dependent on

solder type)

Solder Paste Type: No-Clean as the soldered part to board

clearance will not allow for adequate post solder cleaning.

Rework is technically challenging due to parts on the SIP

reflowing at the same temperature needed for rework. The

SDC-SSD40L cannot be lifted by the shield during rework.

As such, removal of part for rework is not recommended.

Reflow without removal has been successfully used to clear

shorts found during x-ray inspection.

Reflow: The SDC-SSD40L is RoHS compliant and as such is

sensitive to heat. The below graphic details a typical profile for such and device and is provided for

reference purposes.

RF Layout Design Guidelines

The following is a list of RF layout design guidelines and recommendation when installing a Summit radio

into your device.

 Do not run antenna cables directly above or directly below the radio.

 Do not place any parts or run any high speed digital lines below the radio.

 If there are other radios or transmitters located on the device (such as a Bluetooth radio), place the

devices as far apart from each other as possible.

 Ensure that there is the maximum allowable spacing separating the antenna connectors on the

Summit radio from the antenna. In addition, do not place antennas directly above or directly below the

radio.

 Summit recommends the use of a double shielded cable for the connection between the radio and the

antenna elements.

Footprint from the

Summit MSD30/40 PCB